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Paper Abstract and Keywords
Presentation 2008-01-18 16:10
Reliability evaluation of lead free solder joint against vibration load under thermal circumstance
Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.) CPM2007-148 ICD2007-159 Link to ES Tech. Rep. Archives: CPM2007-148 ICD2007-159
Abstract (in Japanese) (See Japanese page) 
(in English) The reliability of electronics solder joints is evaluated for each individual stress even if the electronics devices are used in complex circumstances. Thermal stress and vibration stress are the main factors of the solder joint failure. We investigated the relationship between the plastic strain range caused by vibration load and fatigue life in order to confirm the applicability of the power law to the reliability evaluation for vibration stress at room temperature and at high temperatures. We also indicated the necessity of a reliability evaluation method considering the mechanical property changes of the material with the metal structure change caused by the thermal cycle loading. The fatigue life against the vibration stress after thermal cycle loading decreased more than the damage estimated by the cumulative damage rule. We showed the direction of the reliability evaluation of lead free solder joint against vibration load under thermal circumstance as a complex circumstance.
Keyword (in Japanese) (See Japanese page) 
(in English) lead-free soldering joints / in-car electronics / vibration stress / plastic strain range / reliability evaluation / thermal circumstance / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 425, CPM2007-148, pp. 117-122, Jan. 2008.
Paper # CPM2007-148 
Date of Issue 2008-01-10 (CPM, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF CPM2007-148 ICD2007-159 Link to ES Tech. Rep. Archives: CPM2007-148 ICD2007-159

Conference Information
Committee CPM ICD  
Conference Date 2008-01-17 - 2008-01-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To CPM 
Conference Code 2008-01-CPM-ICD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Reliability evaluation of lead free solder joint against vibration load under thermal circumstance 
Sub Title (in English)  
Keyword(1) lead-free soldering joints  
Keyword(2) in-car electronics  
Keyword(3) vibration stress  
Keyword(4) plastic strain range  
Keyword(5) reliability evaluation  
Keyword(6) thermal circumstance  
1st Author's Name Michiya Matsushima  
1st Author's Affiliation Osaka Uinversity (Osaka Univ.)
2nd Author's Name Toshiyuki Hamano  
2nd Author's Affiliation ESPEC Test Center (ESPEC)
3rd Author's Name Kiyokazu Yasuda  
3rd Author's Affiliation Osaka Uinversity (Osaka Univ.)
4th Author's Name Kozo Fujimoto  
4th Author's Affiliation Osaka Uinversity (Osaka Univ.)
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Speaker Author-1 
Date Time 2008-01-18 16:10:00 
Presentation Time 25 minutes 
Registration for CPM 
Paper # CPM2007-148, ICD2007-159 
Volume (vol) vol.107 
Number (no) no.425(CPM), no.426(ICD) 
Page pp.117-122 
Date of Issue 2008-01-10 (CPM, ICD) 

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