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| Presentation | 2008-01-18 16:10 Reliability evaluation of lead free solder joint against vibration load under thermal circumstance Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.)  CPM2007-148 ICD2007-159 Link to ES Tech. Rep. Archives: CPM2007-148 ICD2007-159 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | The reliability of electronics solder joints is evaluated for each individual stress even if the electronics devices are used in complex circumstances. Thermal stress and vibration stress are the main factors of the solder joint failure. We investigated the relationship between the plastic strain range caused by vibration load and fatigue life in order to confirm the applicability of the power law to the reliability evaluation for vibration stress at room temperature and at high temperatures. We also indicated the necessity of a reliability evaluation method considering the mechanical property changes of the material with the metal structure change caused by the thermal cycle loading. The fatigue life against the vibration stress after thermal cycle loading decreased more than the damage estimated by the cumulative damage rule. We showed the direction of the reliability evaluation of lead free solder joint against vibration load under thermal circumstance as a complex circumstance. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | lead-free soldering joints / in-car electronics / vibration stress / plastic strain range / reliability evaluation / thermal circumstance / / | |
| Reference Info. | IEICE Tech. Rep., vol. 107, no. 425, CPM2007-148, pp. 117-122, Jan. 2008. | |
| Paper # | CPM2007-148 | |
| Date of Issue | 2008-01-10 (CPM, ICD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | CPM2007-148 ICD2007-159 Link to ES Tech. Rep. Archives: CPM2007-148 ICD2007-159 |
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| Conference Information | |
| Committee | CPM ICD |
| Conference Date | 2008-01-17 - 2008-01-18 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | CPM |
| Conference Code | 2008-01-CPM-ICD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Reliability evaluation of lead free solder joint against vibration load under thermal circumstance |
| Sub Title (in English) | |
| Keyword(1) | lead-free soldering joints |
| Keyword(2) | in-car electronics |
| Keyword(3) | vibration stress |
| Keyword(4) | plastic strain range |
| Keyword(5) | reliability evaluation |
| Keyword(6) | thermal circumstance |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Michiya Matsushima |
| 1st Author's Affiliation | Osaka Uinversity (Osaka Univ.) |
| 2nd Author's Name | Toshiyuki Hamano |
| 2nd Author's Affiliation | ESPEC Test Center (ESPEC) |
| 3rd Author's Name | Kiyokazu Yasuda |
| 3rd Author's Affiliation | Osaka Uinversity (Osaka Univ.) |
| 4th Author's Name | Kozo Fujimoto |
| 4th Author's Affiliation | Osaka Uinversity (Osaka Univ.) |
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| Speaker | Author-1 |
| Date Time | 2008-01-18 16:10:00 |
| Presentation Time | 25 minutes |
| Registration for | CPM |
| Paper # | CPM2007-148, ICD2007-159 |
| Volume (vol) | vol.107 |
| Number (no) | no.425(CPM), no.426(ICD) |
| Page | pp.117-122 |
| #Pages | 6 |
| Date of Issue | 2008-01-10 (CPM, ICD) |
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