IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2008-11-21 09:45
Study on Invasiveness and Suppression Effect of Near EM Field around PCB by the EM Suppression Material
Takashi Kasuga, Yuki Matsumoto, Atsushi Nakajiri, Hidetoshi Nakayama (Nagano National College of Technology) EMCJ2008-79
Abstract (in Japanese) (See Japanese page) 
(in English) The purpose of this study is to make clear the suppression effect and invasiveness of the near electromagnetic field by the conductor or magnetic material put on the PCB. The suppression effect and invasiveness by the copper plate, ferrite plate and composite material pasted the copper and ferrite plates together are discussed by the measurement and calculation. The suppression effect by the copper plate increases as the frequency is higher. The suppression effect by the ferrite plate is corresponded to the frequency characteristics of permeability of the ferrite. The suppression effect by the composite suppression material is large than that of the copper or ferrite plates by itself at all frequency band. As the invasiveness for the near electromagnetic field by the FDTD is calculated, it is appeared that the invasiveness for the near magnetic field is large. As the composite material (mc) that the magnetic material is PCB side puts on the PCB, the invasiveness with the electric field between PCB and composite material is small.
Keyword (in Japanese) (See Japanese page) 
(in English) PCB / composite suppression material / near electro-magnetic field / suppression effect / invasiveness / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 307, EMCJ2008-79, pp. 27-32, Nov. 2008.
Paper # EMCJ2008-79 
Date of Issue 2008-11-13 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2008-79

Conference Information
Committee EMCJ  
Conference Date 2008-11-20 - 2008-11-21 
Place (in Japanese) (See Japanese page) 
Place (in English) AIST Tokyo Waterfront 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMCJ 
Conference Code 2008-11-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study on Invasiveness and Suppression Effect of Near EM Field around PCB by the EM Suppression Material 
Sub Title (in English)  
Keyword(1) PCB  
Keyword(2) composite suppression material  
Keyword(3) near electro-magnetic field  
Keyword(4) suppression effect  
Keyword(5) invasiveness  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Takashi Kasuga  
1st Author's Affiliation Nagano National College of Technology (Nagano National College of Technology)
2nd Author's Name Yuki Matsumoto  
2nd Author's Affiliation Nagano National College of Technology (Nagano National College of Technology)
3rd Author's Name Atsushi Nakajiri  
3rd Author's Affiliation Nagano National College of Technology (Nagano National College of Technology)
4th Author's Name Hidetoshi Nakayama  
4th Author's Affiliation Nagano National College of Technology (Nagano National College of Technology)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2008-11-21 09:45:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2008-79 
Volume (vol) vol.108 
Number (no) no.307 
Page pp.27-32 
#Pages
Date of Issue 2008-11-13 (EMCJ) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan