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| Presentation | 2009-01-29 10:35 Si-wire waveguide integrated device Haruhiko Yoshida, Kazuya Ohira, Taisuke Sato, Rei Hashimoto, Norio Iizuka, Nobuo Suzuki, Mizunori Ezaki (Toshiba)  PN2008-46 OPE2008-149 LQE2008-146 Link to ES Tech. Rep. Archives: OPE2008-149 LQE2008-146 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Silicon photonics on an SOI wafer or chip, which enables miniaturized optical interconnection down to submicron scale utilizing silicon-wire waveguide, has been attracting much attention as a promising platform for downsizing optical communication systems and reducing their energy consumption, in order to realize highly efficient functional optoelectronic devices applying nonlinear optical effects enhanced by strong optical confinement, and for overcoming the electronic wiring bottle-neck in increasing processing speed of LSI circuits. A compact spot-size converter, which is capable of efficient coupling between optical fiber and Si-wire, is a key device for both inter-chip and on-chip interconnections, and a cross-connect with small loss and low crosstalk between waveguides is also indispensable in order to realize highly flexible design of waveguide circuits on a chip. A compact and highly efficient photo-detector with high-speed responses integrated with silicon-wire waveguides is one of the most important devices for on-chip optical interconnects. In this paper, we propose a novel compact and efficient spot-size converter with very thin over-cladding and a flying-junction underpass Si-wire cross-connect, which is suited to integration with other optoelectronic devices and electronic circuits on an SOI wafer. These devices are designed by simulating three-dimensional light propagation, and also are demonstrated experimentally. Further, we propose an extremely small InGaAs-based MSM waveguide-photodetector, which is integrated with Si-wire on an SOI wafer, and its capability of highly-efficient operation is shown theoretically. Its fundamental operation at a wavelength of 1.55mm is also demonstrated by fabricating a device, which is integrated on Si-wire waveguide by applying direct wafer bonding. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Optical interconnection / Si-wire / Spot-size converter / Cross waveguide / Photo-detector / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 108, no. 419, LQE2008-146, pp. 21-26, Jan. 2009. | |
| Paper # | LQE2008-146 | |
| Date of Issue | 2009-01-22 (PN, OPE, LQE) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | PN2008-46 OPE2008-149 LQE2008-146 Link to ES Tech. Rep. Archives: OPE2008-149 LQE2008-146 |
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| Conference Information | |
| Committee | PN OPE EMT LQE |
| Conference Date | 2009-01-29 - 2009-01-30 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kyoto Institute Technology (Matsugasaki Campus) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | LQE |
| Conference Code | 2009-01-PN-OPE-EMT-LQE |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Si-wire waveguide integrated device |
| Sub Title (in English) | |
| Keyword(1) | Optical interconnection |
| Keyword(2) | Si-wire |
| Keyword(3) | Spot-size converter |
| Keyword(4) | Cross waveguide |
| Keyword(5) | Photo-detector |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Haruhiko Yoshida |
| 1st Author's Affiliation | Toshiba (Toshiba) |
| 2nd Author's Name | Kazuya Ohira |
| 2nd Author's Affiliation | Toshiba (Toshiba) |
| 3rd Author's Name | Taisuke Sato |
| 3rd Author's Affiliation | Toshiba (Toshiba) |
| 4th Author's Name | Rei Hashimoto |
| 4th Author's Affiliation | Toshiba (Toshiba) |
| 5th Author's Name | Norio Iizuka |
| 5th Author's Affiliation | Toshiba (Toshiba) |
| 6th Author's Name | Nobuo Suzuki |
| 6th Author's Affiliation | Toshiba (Toshiba) |
| 7th Author's Name | Mizunori Ezaki |
| 7th Author's Affiliation | Toshiba (Toshiba) |
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| Speaker | Author-1 |
| Date Time | 2009-01-29 10:35:00 |
| Presentation Time | 25 minutes |
| Registration for | LQE |
| Paper # | PN2008-46, OPE2008-149, LQE2008-146 |
| Volume (vol) | vol.108 |
| Number (no) | no.417(PN), no.418(OPE), no.419(LQE) |
| Page | pp.21-26 |
| #Pages | 6 |
| Date of Issue | 2009-01-22 (PN, OPE, LQE) |
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