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| Presentation | 2009-10-30 17:05 The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay Tomohiro Fukuhara (OMRON Corp.)  EMD2009-67 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | In recent years, electronics components has a trend of increasing Surface Mount type because of needs for densely array components on print circuit board. Surface Mount relays are packaged with sealant to prevent from invasion of solder-flux, foreign matters, corrosive gas, etc. Sealant needing Parts in relay are interdigitation between base and case, and surrounding terminals inserted base. But the base and case are made of Liquid Crystal Polymer, and the terminals are made of cupper. So it is needed sealing the different kinds of materials. It is generally used one-packed epoxy resin adhesives as sealant to fulfill various demanded characteristics for relays, because one-packed epoxy resin adhesives have a good balance of various characteristics. The one-packed epoxy resin adhesives are mainly composed of epoxy resin and curing agents. The characteristics of sealant rely on combination of epoxy resin and curing agent. This report shows that it is needed using Imidazole and dicyandiamide together to realize high sealing spec in Surface Mount relays. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Relay / epoxy / Imidazole / dicyandiamide / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 109, no. 263, EMD2009-67, pp. 51-56, Oct. 2009. | |
| Paper # | EMD2009-67 | |
| Date of Issue | 2009-10-23 (EMD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | EMD2009-67 |
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| Conference Information | |
| Committee | EMD |
| Conference Date | 2009-10-30 - 2009-10-30 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | EMD |
| Conference Code | 2009-10-EMD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay |
| Sub Title (in English) | |
| Keyword(1) | Relay |
| Keyword(2) | epoxy |
| Keyword(3) | Imidazole |
| Keyword(4) | dicyandiamide |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Tomohiro Fukuhara |
| 1st Author's Affiliation | OMRON Corporation (OMRON Corp.) |
| 2nd Author's Name | |
| 2nd Author's Affiliation | () |
| 3rd Author's Name | |
| 3rd Author's Affiliation | () |
| 4th Author's Name | |
| 4th Author's Affiliation | () |
| 5th Author's Name | |
| 5th Author's Affiliation | () |
| 6th Author's Name | |
| 6th Author's Affiliation | () |
| Speaker | Author-1 |
| Date Time | 2009-10-30 17:05:00 |
| Presentation Time | 25 minutes |
| Registration for | EMD |
| Paper # | EMD2009-67 |
| Volume (vol) | vol.109 |
| Number (no) | no.263 |
| Page | pp.51-56 |
| #Pages | 6 |
| Date of Issue | 2009-10-23 (EMD) |
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