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Paper Abstract and Keywords
Presentation 2009-10-30 17:05
The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay
Tomohiro Fukuhara (OMRON Corp.) EMD2009-67 Link to ES Tech. Rep. Archives: EMD2009-67
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, electronics components has a trend of increasing Surface Mount type because of needs for densely array components on print circuit board. Surface Mount relays are packaged with sealant to prevent from invasion of solder-flux, foreign matters, corrosive gas, etc. Sealant needing Parts in relay are interdigitation between base and case, and surrounding terminals inserted base. But the base and case are made of Liquid Crystal Polymer, and the terminals are made of cupper. So it is needed sealing the different kinds of materials. It is generally used one-packed epoxy resin adhesives as sealant to fulfill various demanded characteristics for relays, because one-packed epoxy resin adhesives have a good balance of various characteristics. The one-packed epoxy resin adhesives are mainly composed of epoxy resin and curing agents. The characteristics of sealant rely on combination of epoxy resin and curing agent. This report shows that it is needed using Imidazole and dicyandiamide together to realize high sealing spec in Surface Mount relays.
Keyword (in Japanese) (See Japanese page) 
(in English) Relay / epoxy / Imidazole / dicyandiamide / / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 263, EMD2009-67, pp. 51-56, Oct. 2009.
Paper # EMD2009-67 
Date of Issue 2009-10-23 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMD  
Conference Date 2009-10-30 - 2009-10-30 
Place (in Japanese) (See Japanese page) 
Place (in English)  
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Paper Information
Registration To EMD 
Conference Code 2009-10-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay 
Sub Title (in English)  
Keyword(1) Relay  
Keyword(2) epoxy  
Keyword(3) Imidazole  
Keyword(4) dicyandiamide  
1st Author's Name Tomohiro Fukuhara  
1st Author's Affiliation OMRON Corporation (OMRON Corp.)
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Speaker Author-1 
Date Time 2009-10-30 17:05:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # EMD2009-67 
Volume (vol) vol.109 
Number (no) no.263 
Page pp.51-56 
Date of Issue 2009-10-23 (EMD) 

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