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| Presentation | 2010-01-15 11:45 Cost Effective Wafer-Level Chip Size Package Technology and Application for High Speed Wireless Communications. Seiji Fujita, Masaki Imagawa, Tomio Satoh (SEDI), Tsuneo Tokumitsu (SEI), Yuichi Hasegawa (SEDI)  ED2009-195 MW2009-178 Link to ES Tech. Rep. Archives: ED2009-195 MW2009-178 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Cost effective Ku-band up-mixer and down-mixer MMIC’s, that use a three-dimensional MMIC technology optimized for flip-chip implementation, are presented. The MMIC structure incorporates inverse TFMS lines so that a ground metal can be applied to cover the whole chip surface except for interconnect pads. Among multi polyimide and SiN layers, four wiring metal layers are composed. Hence, these MMIC chips require no package, as well as can be directly assembled on PC board. The up-mixer MMIC is composed of a pair of balanced mixers, which are doubly balanced with additional quadrature couplers, and a LO amplifier. The down-mixer is composed of an image-rejection mixer, a LO amplifier and a low-noise amplifier with a noise figure of 3.2 dB. The amplifiers are very linear and provide an OIP3 of nearly 25dBm. The up-mixer exhibits a conversion loss of the 12dB, the IMD ratios of nearly -55dBc at -5dBm 2-tone IF input. The LO-to-RF leakage suppression is as well as -30dBc. The down-mixer exhibits a conversion gain of 6.5dB, a noise figure of nearly 3.7dB, and an IIP3 of 0dBm to 5dBm between 12GHz and 16GHz. The die size of them is 2.4mm x 2.4mm and consumes 36mA and 72mA, respectively, fed from 5V power supply. |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | WLCSP / three-dimensional / wireless communications / up-converter / down-converter / flipchip / mixer / | |
| Reference Info. | IEICE Tech. Rep., vol. 109, no. 361, MW2009-178, pp. 117-121, Jan. 2010. | |
| Paper # | MW2009-178 | |
| Date of Issue | 2010-01-06 (ED, MW) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | ED2009-195 MW2009-178 Link to ES Tech. Rep. Archives: ED2009-195 MW2009-178 |
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| Conference Information | |
| Committee | ED MW |
| Conference Date | 2010-01-13 - 2010-01-15 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | MW |
| Conference Code | 2010-01-ED-MW |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Cost Effective Wafer-Level Chip Size Package Technology and Application for High Speed Wireless Communications. |
| Sub Title (in English) | |
| Keyword(1) | WLCSP |
| Keyword(2) | three-dimensional |
| Keyword(3) | wireless communications |
| Keyword(4) | up-converter |
| Keyword(5) | down-converter |
| Keyword(6) | flipchip |
| Keyword(7) | mixer |
| Keyword(8) | |
| 1st Author's Name | Seiji Fujita |
| 1st Author's Affiliation | Sumitomo Electric Device Innovations INC (SEDI) |
| 2nd Author's Name | Masaki Imagawa |
| 2nd Author's Affiliation | Sumitomo Electric Device Innovations INC (SEDI) |
| 3rd Author's Name | Tomio Satoh |
| 3rd Author's Affiliation | Sumitomo Electric Device Innovations INC (SEDI) |
| 4th Author's Name | Tsuneo Tokumitsu |
| 4th Author's Affiliation | Sumitomo Electric Industries, Ltd (SEI) |
| 5th Author's Name | Yuichi Hasegawa |
| 5th Author's Affiliation | Sumitomo Electric Device Innovations INC (SEDI) |
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| Speaker | Author-1 |
| Date Time | 2010-01-15 11:45:00 |
| Presentation Time | 25 minutes |
| Registration for | MW |
| Paper # | ED2009-195, MW2009-178 |
| Volume (vol) | vol.109 |
| Number (no) | no.360(ED), no.361(MW) |
| Page | pp.117-121 |
| #Pages | 5 |
| Date of Issue | 2010-01-06 (ED, MW) |
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