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Paper Abstract and Keywords
Presentation 2010-06-30 16:30
50-Gbit/s MUX/DEMUX IC modules using feed-trough type metal-wall package technique
Satoshi Tsunashima, Michihiro Hirata, Koichi Murata (NTT Corp.) ED2010-72 SDM2010-73 Link to ES Tech. Rep. Archives: ED2010-72 SDM2010-73
Abstract (in Japanese) (See Japanese page) 
(in English) A broadband metal-wall (MW) package that uses a feed-through RF interface has been developed for 50-Gbit/s multiplexer (MUX) and demultiplexer (DEMUX) ICs, and have developed test fixture for the package. The 3-dB down bandwidth of the package is over 60-GHz, and the return loss is less than –15 dB up to 50 GHz. We confirmed 50-Gbit/s error-free operation of MUX and DEMUX packaged ICs and test fixture.
Keyword (in Japanese) (See Japanese page) 
(in English) Feed-through / package / broadband / MUX / DEMUX / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 109, ED2010-72, pp. 91-96, June 2010.
Paper # ED2010-72 
Date of Issue 2010-06-23 (ED, SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2010-72 SDM2010-73 Link to ES Tech. Rep. Archives: ED2010-72 SDM2010-73

Conference Information
Committee ED SDM  
Conference Date 2010-06-30 - 2010-07-02 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Inst. of Tech. Ookayama Campus 
Topics (in Japanese) (See Japanese page) 
Topics (in English) 2010 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices 
Paper Information
Registration To ED 
Conference Code 2010-06-ED-SDM 
Language English (Japanese title is available) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 50-Gbit/s MUX/DEMUX IC modules using feed-trough type metal-wall package technique 
Sub Title (in English)  
Keyword(1) Feed-through  
Keyword(2) package  
Keyword(3) broadband  
Keyword(4) MUX  
Keyword(5) DEMUX  
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1st Author's Name Satoshi Tsunashima  
1st Author's Affiliation NTT Photonics Laboratories, NTT Corporation. (NTT Corp.)
2nd Author's Name Michihiro Hirata  
2nd Author's Affiliation NTT Electronics Corporation (NTT Corp.)
3rd Author's Name Koichi Murata  
3rd Author's Affiliation NTT Photonics Laboratories, NTT Corporation. (NTT Corp.)
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Speaker Author-1 
Date Time 2010-06-30 16:30:00 
Presentation Time 15 minutes 
Registration for ED 
Paper # ED2010-72, SDM2010-73 
Volume (vol) vol.110 
Number (no) no.109(ED), no.110(SDM) 
Page pp.91-96 
#Pages
Date of Issue 2010-06-23 (ED, SDM) 


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