Paper Abstract and Keywords |
Presentation |
2010-06-30 16:30
50-Gbit/s MUX/DEMUX IC modules using feed-trough type metal-wall package technique Satoshi Tsunashima, Michihiro Hirata, Koichi Murata (NTT Corp.) ED2010-72 SDM2010-73 Link to ES Tech. Rep. Archives: ED2010-72 SDM2010-73 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
A broadband metal-wall (MW) package that uses a feed-through RF interface has been developed for 50-Gbit/s multiplexer (MUX) and demultiplexer (DEMUX) ICs, and have developed test fixture for the package. The 3-dB down bandwidth of the package is over 60-GHz, and the return loss is less than –15 dB up to 50 GHz. We confirmed 50-Gbit/s error-free operation of MUX and DEMUX packaged ICs and test fixture. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Feed-through / package / broadband / MUX / DEMUX / / / |
Reference Info. |
IEICE Tech. Rep., vol. 110, no. 109, ED2010-72, pp. 91-96, June 2010. |
Paper # |
ED2010-72 |
Date of Issue |
2010-06-23 (ED, SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
ED2010-72 SDM2010-73 Link to ES Tech. Rep. Archives: ED2010-72 SDM2010-73 |
Conference Information |
Committee |
ED SDM |
Conference Date |
2010-06-30 - 2010-07-02 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Tokyo Inst. of Tech. Ookayama Campus |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
2010 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices |
Paper Information |
Registration To |
ED |
Conference Code |
2010-06-ED-SDM |
Language |
English (Japanese title is available) |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
50-Gbit/s MUX/DEMUX IC modules using feed-trough type metal-wall package technique |
Sub Title (in English) |
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Keyword(1) |
Feed-through |
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package |
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broadband |
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MUX |
Keyword(5) |
DEMUX |
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1st Author's Name |
Satoshi Tsunashima |
1st Author's Affiliation |
NTT Photonics Laboratories, NTT Corporation. (NTT Corp.) |
2nd Author's Name |
Michihiro Hirata |
2nd Author's Affiliation |
NTT Electronics Corporation (NTT Corp.) |
3rd Author's Name |
Koichi Murata |
3rd Author's Affiliation |
NTT Photonics Laboratories, NTT Corporation. (NTT Corp.) |
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Speaker |
Author-1 |
Date Time |
2010-06-30 16:30:00 |
Presentation Time |
15 minutes |
Registration for |
ED |
Paper # |
ED2010-72, SDM2010-73 |
Volume (vol) |
vol.110 |
Number (no) |
no.109(ED), no.110(SDM) |
Page |
pp.91-96 |
#Pages |
6 |
Date of Issue |
2010-06-23 (ED, SDM) |
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