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| Presentation | 2010-08-27 10:15 [Invited Talk] Development of sub-10um Thinning Technology using Actual Device Wafers Nobuhide Maeda, Kim Youngsuk (Univ. of Tokyo), Yukinobu Hikosaka, Takashi Eshita (FSL), Hideki Kitada, Koji Fujimoto (Univ. of Tokyo), Yoriko Mizushima (Fujitsu Labs.), Kousuke Suzuki (DNP), Tomoji Nakamura (Fujitsu Labs.), Akihito Kawai, Kazuhisa Arai (DISCO), Takayuki Ohba (Univ. of Tokyo)  SDM2010-141 ICD2010-56 Link to ES Tech. Rep. Archives: SDM2010-141 ICD2010-56 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | 200-mm and 300-mm device wafers were successfully thinned down to less than 10-μm. A 200-nm non-crystalline layer remaining after the high-rate Back Grind process was partially removed down to 50-nm by Ultra Poligrind process, or was completely removed with either Chemical Mechanical Planarization or Dry Polish. For FRAM device wafers thinned down to 9-μm, switching charge showed no change by the thinning process. CMOS logic device wafers thinned to 7-μm indicated neither change in Ion current nor junction leakage current. Thinning such wafers to <10-μm will allow for lower aspect ratio less than 4 of Through-Silicon-Via (TSV) in a via-last process. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D Integration / Wafer thinning / WOW / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 110, no. 182, SDM2010-141, pp. 95-97, Aug. 2010. | |
| Paper # | SDM2010-141 | |
| Date of Issue | 2010-08-19 (SDM, ICD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2010-141 ICD2010-56 Link to ES Tech. Rep. Archives: SDM2010-141 ICD2010-56 |
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| Conference Information | |
| Committee | ICD SDM |
| Conference Date | 2010-08-26 - 2010-08-27 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Sapporo Center for Gender Equality |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Low voltage/low power techniques, novel devices, circuits, and applications |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2010-08-ICD-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of sub-10um Thinning Technology using Actual Device Wafers |
| Sub Title (in English) | |
| Keyword(1) | 3D Integration |
| Keyword(2) | Wafer thinning |
| Keyword(3) | WOW |
| Keyword(4) | |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Nobuhide Maeda |
| 1st Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
| 2nd Author's Name | Kim Youngsuk |
| 2nd Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
| 3rd Author's Name | Yukinobu Hikosaka |
| 3rd Author's Affiliation | Fujitsu Semiconductor Limited (FSL) |
| 4th Author's Name | Takashi Eshita |
| 4th Author's Affiliation | Fujitsu Semiconductor Limited (FSL) |
| 5th Author's Name | Hideki Kitada |
| 5th Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
| 6th Author's Name | Koji Fujimoto |
| 6th Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
| 7th Author's Name | Yoriko Mizushima |
| 7th Author's Affiliation | Fujitsu Laboratories Limited (Fujitsu Labs.) |
| 8th Author's Name | Kousuke Suzuki |
| 8th Author's Affiliation | Dai Nippon Printing Co., Ltd. (DNP) |
| 9th Author's Name | Tomoji Nakamura |
| 9th Author's Affiliation | Fujitsu Laboratories Limited (Fujitsu Labs.) |
| 10th Author's Name | Akihito Kawai |
| 10th Author's Affiliation | DISCO Corporation (DISCO) |
| 11th Author's Name | Kazuhisa Arai |
| 11th Author's Affiliation | DISCO Corporation (DISCO) |
| 12th Author's Name | Takayuki Ohba |
| 12th Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
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| 13th Author's Affiliation | () |
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| 14th Author's Affiliation | () |
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| 15th Author's Affiliation | () |
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| 18th Author's Affiliation | () |
| Speaker | Author-1 |
| Date Time | 2010-08-27 10:15:00 |
| Presentation Time | 50 minutes |
| Registration for | SDM |
| Paper # | SDM2010-141, ICD2010-56 |
| Volume (vol) | vol.110 |
| Number (no) | no.182(SDM), no.183(ICD) |
| Page | pp.95-97 |
| #Pages | 3 |
| Date of Issue | 2010-08-19 (SDM, ICD) |
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