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Paper Abstract and Keywords
Presentation 2011-02-07 14:55
Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps
Murugesan Mariappan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2010-223 Link to ES Tech. Rep. Archives: SDM2010-223
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
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Reference Info. IEICE Tech. Rep., vol. 110, no. 408, SDM2010-223, pp. 43-47, Feb. 2011.
Paper # SDM2010-223 
Date of Issue 2011-01-31 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2010-223 Link to ES Tech. Rep. Archives: SDM2010-223

Conference Information
Committee SDM  
Conference Date 2011-02-07 - 2011-02-07 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2011-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps 
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1st Author's Name Murugesan Mariappan  
1st Author's Affiliation New Industry Creation Hatchery Center (NICHe), Tohoku University (Tohoku Univ.)
2nd Author's Name Takafumi Fukushima  
2nd Author's Affiliation New Industry Creation Hatchery Center (NICHe), Tohoku University (Tohoku Univ.)
3rd Author's Name Tetsu Tanaka  
3rd Author's Affiliation Dept. of Biomedical Engineering, Tohoku Univ. (Tohoku Univ.)
4th Author's Name Mitsumasa Koyanagi  
4th Author's Affiliation New Industry Creation Hatchery Center (NICHe), Tohoku University (Tohoku Univ.)
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Date Time 2011-02-07 14:55:00 
Presentation Time 30 minutes 
Registration for SDM 
Paper # SDM2010-223 
Volume (vol) vol.110 
Number (no) no.408 
Page pp.43-47 
#Pages
Date of Issue 2011-01-31 (SDM) 


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