| IEICE Technical Committee Submission System Conference Paper's Information |
Online Proceedings [Sign in] Tech. Rep. Archives |
| Go Top Page | Go Previous | [Japanese] / [English] |
| Paper Abstract and Keywords | ||
| Presentation | 2011-02-07 15:25 Development of Low Temperature Bump-less TSV Process in 3D Stacking Technology Hideki Kitada, Nobuhide Maeda (The Univ. of Tokyo), Koji Fujimoto (Dai Nippon Printing), Yoriko Mizushima, Yoshihiro Nakata, Tomoji Nakamura (Fujitsu Laboratories Ltd.), Takayuki Ohba (The Univ. of Tokyo)  SDM2010-224 Link to ES Tech. Rep. Archives: SDM2010-224 |
|
| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Diffusion behavior of Cu in Cu through-silicon-vias (TSVs) fabricated using low-temperature plasma enhanced chemical vapor deposition (LT-PECVD) has been evaluated. Silicon oxy-nitride (SiON) barrier films were formed by LT-PECVD at 150°C. Cu diffusion rate was found to increase with decreasing film density. The critical density and thickness for prevention of Cu diffusion into Si substrate have been estimated. In case of a film with density >60% of the bulk value and/or thickness >100 nm, no change of electrical resistance for stacked wafers containing TSVs was observed after 1000 cycles of thermal stress. According to above results, SiON film formed at 150°C can be used for the TSV process without any degradation of electrical characteristics and reliability, enabling a reduction in total process temperature in the wafer-on-wafer technology. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D-IC / TSV / LT-PECVD / Diffusion barrier / BS-SIMS / XPS / Film density / | |
| Reference Info. | IEICE Tech. Rep., vol. 110, no. 408, SDM2010-224, pp. 49-53, Feb. 2011. | |
| Paper # | SDM2010-224 | |
| Date of Issue | 2011-01-31 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2010-224 Link to ES Tech. Rep. Archives: SDM2010-224 |
|
| Conference Information | |
| Committee | SDM |
| Conference Date | 2011-02-07 - 2011-02-07 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2011-02-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of Low Temperature Bump-less TSV Process in 3D Stacking Technology |
| Sub Title (in English) | |
| Keyword(1) | 3D-IC |
| Keyword(2) | TSV |
| Keyword(3) | LT-PECVD |
| Keyword(4) | Diffusion barrier |
| Keyword(5) | BS-SIMS |
| Keyword(6) | XPS |
| Keyword(7) | Film density |
| Keyword(8) | |
| 1st Author's Name | Hideki Kitada |
| 1st Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
| 2nd Author's Name | Nobuhide Maeda |
| 2nd Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
| 3rd Author's Name | Koji Fujimoto |
| 3rd Author's Affiliation | Dai Nippon Printing (Dai Nippon Printing) |
| 4th Author's Name | Yoriko Mizushima |
| 4th Author's Affiliation | Fujitsu Laboratories Ltd. (Fujitsu Laboratories Ltd.) |
| 5th Author's Name | Yoshihiro Nakata |
| 5th Author's Affiliation | Fujitsu Laboratories Ltd. (Fujitsu Laboratories Ltd.) |
| 6th Author's Name | Tomoji Nakamura |
| 6th Author's Affiliation | Fujitsu Laboratories Ltd. (Fujitsu Laboratories Ltd.) |
| 7th Author's Name | Takayuki Ohba |
| 7th Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
| 8th Author's Name | |
| 8th Author's Affiliation | () |
| 9th Author's Name | |
| 9th Author's Affiliation | () |
| 10th Author's Name | |
| 10th Author's Affiliation | () |
| 11th Author's Name | |
| 11th Author's Affiliation | () |
| 12th Author's Name | |
| 12th Author's Affiliation | () |
| 13th Author's Name | |
| 13th Author's Affiliation | () |
| 14th Author's Name | |
| 14th Author's Affiliation | () |
| 15th Author's Name | |
| 15th Author's Affiliation | () |
| 16th Author's Name | |
| 16th Author's Affiliation | () |
| 17th Author's Name | |
| 17th Author's Affiliation | () |
| 18th Author's Name | |
| 18th Author's Affiliation | () |
| Speaker | Author-1 |
| Date Time | 2011-02-07 15:25:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2010-224 |
| Volume (vol) | vol.110 |
| Number (no) | no.408 |
| Page | pp.49-53 |
| #Pages | 5 |
| Date of Issue | 2011-01-31 (SDM) |
[Return to Top Page]