IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2011-07-15 14:00
Magnetic Pulse Welding of Laminated Aluminum Foils
Tomokatsu Aizawa, Kazuo Matsuzawa, Keigo Okagawa (Tokyo Metropolitan College) EMCJ2011-65 EMD2011-24 Link to ES Tech. Rep. Archives: EMD2011-24
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes a new welding technique for laminated aluminum foils and its experimental results. When an impulse current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in laminated aluminum foils (12μm thick) and an insulated copper foil (50μm thick) on the coil. Ten pieces of the laminated foils can be welded both by the Joule heat generated in them and by the electromagnetic force applied to them. The copper foil prevents the aluminum foils from melting. The bank energy required for this welding is less than 1.0 kJ.
Keyword (in Japanese) (See Japanese page) 
(in English) Aluminum foil / Laminated foils / Pressure welding / Magnetic pulse welding / Electromagnetic force / Eddy current / /  
Reference Info. IEICE Tech. Rep., vol. 111, no. 138, EMD2011-24, pp. 25-28, July 2011.
Paper # EMD2011-24 
Date of Issue 2011-07-08 (EMCJ, EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2011-65 EMD2011-24 Link to ES Tech. Rep. Archives: EMD2011-24

Conference Information
Committee EMD EMCJ  
Conference Date 2011-07-15 - 2011-07-15 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Discharge, EMC, etc. 
Paper Information
Registration To EMD 
Conference Code 2011-07-EMD-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Magnetic Pulse Welding of Laminated Aluminum Foils 
Sub Title (in English)  
Keyword(1) Aluminum foil  
Keyword(2) Laminated foils  
Keyword(3) Pressure welding  
Keyword(4) Magnetic pulse welding  
Keyword(5) Electromagnetic force  
Keyword(6) Eddy current  
1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
2nd Author's Name Kazuo Matsuzawa  
2nd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
3rd Author's Name Keigo Okagawa  
3rd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2011-07-15 14:00:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # EMCJ2011-65, EMD2011-24 
Volume (vol) vol.111 
Number (no) no.137(EMCJ), no.138(EMD) 
Page pp.25-28 
Date of Issue 2011-07-08 (EMCJ, EMD) 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan