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| Presentation | 2012-03-05 15:55 Characterization of Local Strain around Through Silicon Via Interconnect in Wafer-on-wafer Structures Osamu Nakatsuka (Nagoya Univ.), Hideki Kitada, Young Suk Kim (Univ. of Tokyo), Yoriko Mizushima, Tomoji Nakamura (Fujitsu Lab.), Takayuki Ohba (Univ. of Tokyo), Shigeaki Zaima (Nagoya Univ.)  SDM2011-184 Link to ES Tech. Rep. Archives: SDM2011-184 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | We have investigated the local strain structure in a thinned Si layer stacked on Si substrate for wafer-on-a-wafer applications by using micro Raman spectroscopy and x-ray microdiffraction. The fluctuation of strains in the thin Si layer around through-silicon via (TSV) interconnects is observed with a sub-micrometer scale. We separately estimated the in-plane and out-of-plane strains in the thin Si layer with x-ray diffraction two-dimensional reciprocal space mapping. We found that the anisotropic strain structure is induced in the thin Si layer around TSV interconnects. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Thorough Si via interconnect / Strain / Microdiffraction / Wafer bonding / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 111, no. 463, SDM2011-184, pp. 47-52, March 2012. | |
| Paper # | SDM2011-184 | |
| Date of Issue | 2012-02-27 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2011-184 Link to ES Tech. Rep. Archives: SDM2011-184 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2012-03-05 - 2012-03-05 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Wiring and Assembly Technology, etc |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2012-03-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Characterization of Local Strain around Through Silicon Via Interconnect in Wafer-on-wafer Structures |
| Sub Title (in English) | |
| Keyword(1) | Thorough Si via interconnect |
| Keyword(2) | Strain |
| Keyword(3) | Microdiffraction |
| Keyword(4) | Wafer bonding |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Osamu Nakatsuka |
| 1st Author's Affiliation | Nagoya University (Nagoya Univ.) |
| 2nd Author's Name | Hideki Kitada |
| 2nd Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
| 3rd Author's Name | Young Suk Kim |
| 3rd Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
| 4th Author's Name | Yoriko Mizushima |
| 4th Author's Affiliation | Fujitsu Laboratories Ltd. (Fujitsu Lab.) |
| 5th Author's Name | Tomoji Nakamura |
| 5th Author's Affiliation | Fujitsu Laboratories Ltd. (Fujitsu Lab.) |
| 6th Author's Name | Takayuki Ohba |
| 6th Author's Affiliation | The University of Tokyo (Univ. of Tokyo) |
| 7th Author's Name | Shigeaki Zaima |
| 7th Author's Affiliation | Nagoya University (Nagoya Univ.) |
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| Speaker | Author-1 |
| Date Time | 2012-03-05 15:55:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2011-184 |
| Volume (vol) | vol.111 |
| Number (no) | no.463 |
| Page | pp.47-52 |
| #Pages | 6 |
| Date of Issue | 2012-02-27 (SDM) |
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