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| Presentation | 2012-03-05 14:00 Evaluation of additives effects in copper electroplating solution by rapid exchange using microfluidic reactor Takeyasu Saito, Yutaka Miyamoto, Sunao Hattori, Naoki Okamoto, Kazuo Kondo (Osaka Prefecture Univ.)  SDM2011-181 Link to ES Tech. Rep. Archives: SDM2011-181 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | The adsorption behaviour of additives during copper electrodeposition was investigated by the microfluidic reactor. We measured the current-density transition curves by changing solutions from the base electrolyte with Cl－ to the electrolytes with Cl－, poly(ethylene glycol) (PEG), bis(3-sulfopropyl) disulfide (SPS), and Janus Green B (JGB). The effective surface coverage ratio (EFF) was 0.65 when PEG (200 ppm) was supplied, and the adsorption equilibrium constant of PEG was determined as ca. 0.055 ppm-1. Based on flow-cell type electrochemical quartz crystal microbalance measurements, we found that there is a strong correlation between weight increase of PEG and current density decrease. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Copper / Electrodeposition / Organic Additives / Microfluidic Reactor / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 111, no. 463, SDM2011-181, pp. 31-35, March 2012. | |
| Paper # | SDM2011-181 | |
| Date of Issue | 2012-02-27 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2011-181 Link to ES Tech. Rep. Archives: SDM2011-181 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2012-03-05 - 2012-03-05 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Wiring and Assembly Technology, etc |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2012-03-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluation of additives effects in copper electroplating solution by rapid exchange using microfluidic reactor |
| Sub Title (in English) | |
| Keyword(1) | Copper |
| Keyword(2) | Electrodeposition |
| Keyword(3) | Organic Additives |
| Keyword(4) | Microfluidic Reactor |
| Keyword(5) | |
| Keyword(6) | |
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| Keyword(8) | |
| 1st Author's Name | Takeyasu Saito |
| 1st Author's Affiliation | Osaka Prefecture University (Osaka Prefecture Univ.) |
| 2nd Author's Name | Yutaka Miyamoto |
| 2nd Author's Affiliation | Osaka Prefecture University (Osaka Prefecture Univ.) |
| 3rd Author's Name | Sunao Hattori |
| 3rd Author's Affiliation | Osaka Prefecture University (Osaka Prefecture Univ.) |
| 4th Author's Name | Naoki Okamoto |
| 4th Author's Affiliation | Osaka Prefecture University (Osaka Prefecture Univ.) |
| 5th Author's Name | Kazuo Kondo |
| 5th Author's Affiliation | Osaka Prefecture University (Osaka Prefecture Univ.) |
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| Speaker | Author-1 |
| Date Time | 2012-03-05 14:00:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2011-181 |
| Volume (vol) | vol.111 |
| Number (no) | no.463 |
| Page | pp.31-35 |
| #Pages | 5 |
| Date of Issue | 2012-02-27 (SDM) |
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