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| Presentation | 2012-03-05 15:25 Influence of Via Stress on Surface Micro-roughness-induced Leakage Current in Through-Silicon Via Interconnects Hideki Kitada (Univ. of Tokyo/Fujitsu Lab.), Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama, Young Suk Kim (Univ. of Tokyo), Yoriko Mizushima (Univ. of Tokyo/Fujitsu Lab.), Tomoji Nakamura (Fujitsu Lab.), Takayuki Ohba (Univ. of Tokyo)  SDM2011-183 Link to ES Tech. Rep. Archives: SDM2011-183 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | (Not available yet) | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | / / / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 111, no. 463, SDM2011-183, pp. 41-46, March 2012. | |
| Paper # | SDM2011-183 | |
| Date of Issue | 2012-02-27 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2011-183 Link to ES Tech. Rep. Archives: SDM2011-183 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2012-03-05 - 2012-03-05 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Wiring and Assembly Technology, etc |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2012-03-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Influence of Via Stress on Surface Micro-roughness-induced Leakage Current in Through-Silicon Via Interconnects |
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| 1st Author's Name | Hideki Kitada |
| 1st Author's Affiliation | Univ. of Tokyo/Fujitsu Lab. (Univ. of Tokyo/Fujitsu Lab.) |
| 2nd Author's Name | Nobuhide Maeda |
| 2nd Author's Affiliation | Univ. of Tokyo (Univ. of Tokyo) |
| 3rd Author's Name | Koji Fujimoto |
| 3rd Author's Affiliation | Univ. of Tokyo (Univ. of Tokyo) |
| 4th Author's Name | Shoichi Kodama |
| 4th Author's Affiliation | Univ. of Tokyo (Univ. of Tokyo) |
| 5th Author's Name | Young Suk Kim |
| 5th Author's Affiliation | Univ. of Tokyo (Univ. of Tokyo) |
| 6th Author's Name | Yoriko Mizushima |
| 6th Author's Affiliation | Univ. of Tokyo/Fujitsu Lab. (Univ. of Tokyo/Fujitsu Lab.) |
| 7th Author's Name | Tomoji Nakamura |
| 7th Author's Affiliation | Fujitsu Lab. (Fujitsu Lab.) |
| 8th Author's Name | Takayuki Ohba |
| 8th Author's Affiliation | Univ. of Tokyo (Univ. of Tokyo) |
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| Speaker | Author-1 |
| Date Time | 2012-03-05 15:25:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2011-183 |
| Volume (vol) | vol.111 |
| Number (no) | no.463 |
| Page | pp.41-46 |
| #Pages | 6 |
| Date of Issue | 2012-02-27 (SDM) |
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