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| Presentation | 2012-08-02 14:15 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems Fumito Imura, Shunsuke Nemoto, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa (AIST), Michiya Hagimoto, Hiroyuki Uchida, Takashi Omori, Yasumori Hibi, Yukoh Matsumoto (TOPS Systems), Masahiro Aoyagi (AIST)  SDM2012-71 ICD2012-39 Link to ES Tech. Rep. Archives: SDM2012-71 ICD2012-39 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | We have proposed the ultrawide-interchip-bus system for the interchip communication of the 3-dimentional stacked LSI systems. The ultrawide-interchip-bus is assembled in the center of the 3-D stacked LSI by interconnection of the TSVs and micro-bumps array. In this paper, the 3-D interconnect technology, which are achieved by the fabrication of low-capacitance TSVs and the low-stress bonding process of Au cone-bumps, on the basic concept of the ultrawide-interchips-bus system is reported. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D stacked LSI / TSV / Au cone-bump / 3D interconnect / Ultrawide interchip bus / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 112, no. 170, ICD2012-39, pp. 43-48, Aug. 2012. | |
| Paper # | ICD2012-39 | |
| Date of Issue | 2012-07-26 (SDM, ICD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2012-71 ICD2012-39 Link to ES Tech. Rep. Archives: SDM2012-71 ICD2012-39 |
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| Conference Information | |
| Committee | ICD SDM |
| Conference Date | 2012-08-02 - 2012-08-03 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Sapporo Center for Gender Equality, Sapporo, Hokkaido |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Low-power, low-voltage device and circuit technology |
| Paper Information | |
| Registration To | ICD |
| Conference Code | 2012-08-ICD-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems |
| Sub Title (in English) | |
| Keyword(1) | 3D stacked LSI |
| Keyword(2) | TSV |
| Keyword(3) | Au cone-bump |
| Keyword(4) | 3D interconnect |
| Keyword(5) | Ultrawide interchip bus |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Fumito Imura |
| 1st Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 2nd Author's Name | Shunsuke Nemoto |
| 2nd Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 3rd Author's Name | Naoya Watanabe |
| 3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 4th Author's Name | Fumiki Kato |
| 4th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 5th Author's Name | Katsuya Kikuchi |
| 5th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 6th Author's Name | Hiroshi Nakagawa |
| 6th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 7th Author's Name | Michiya Hagimoto |
| 7th Author's Affiliation | TOPS Systems Corp. (TOPS Systems) |
| 8th Author's Name | Hiroyuki Uchida |
| 8th Author's Affiliation | TOPS Systems Corp. (TOPS Systems) |
| 9th Author's Name | Takashi Omori |
| 9th Author's Affiliation | TOPS Systems Corp. (TOPS Systems) |
| 10th Author's Name | Yasumori Hibi |
| 10th Author's Affiliation | TOPS Systems Corp. (TOPS Systems) |
| 11th Author's Name | Yukoh Matsumoto |
| 11th Author's Affiliation | TOPS Systems Corp. (TOPS Systems) |
| 12th Author's Name | Masahiro Aoyagi |
| 12th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 13th Author's Name | |
| 13th Author's Affiliation | () |
| 14th Author's Name | |
| 14th Author's Affiliation | () |
| 15th Author's Name | |
| 15th Author's Affiliation | () |
| 16th Author's Name | |
| 16th Author's Affiliation | () |
| 17th Author's Name | |
| 17th Author's Affiliation | () |
| 18th Author's Name | |
| 18th Author's Affiliation | () |
| Speaker | Author-1 |
| Date Time | 2012-08-02 14:15:00 |
| Presentation Time | 25 minutes |
| Registration for | ICD |
| Paper # | SDM2012-71, ICD2012-39 |
| Volume (vol) | vol.112 |
| Number (no) | no.169(SDM), no.170(ICD) |
| Page | pp.43-48 |
| #Pages | 6 |
| Date of Issue | 2012-07-26 (SDM, ICD) |
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