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Paper Abstract and Keywords
Presentation 2013-11-28 13:30
Electrical properties of Si/SiC heterojunctions fabricated using surface-activated bonding
Shota Nishida, Jianbo Liang, Masashi Morimoto, Naoteru Shigekawa (Osaka City Univ.), Manabu Arai (New Japan Radio) ED2013-68 CPM2013-127 LQE2013-103 Link to ES Tech. Rep. Archives: ED2013-68 CPM2013-127 LQE2013-103
Abstract (in Japanese) (See Japanese page) 
(in English) The physical and electrical properties of p+-Si/n-4H-SiC heterojunctions with and without being annealed fabricated by using surface-activated bonding (SAB) were investigated by scanning electron microscopy (SEM), current-voltage (I-V), capacitance-voltage (C-V), and breakdown characteristics measurements. The I-V characteristics of p+-Si/n-4H-SiC junctions showed rectifying properties at room temperature. The flat-band voltage was around 1.0V and the conduction band offset of p+-Si/n-4H-SiC junctions was determined to be ~0.02 eV from the C-V characteristics. The obtained breakdown voltages from the breakdown characteristics corresponded to the electric field of ~0.88 MV/cm (not annealing) and ~2.11 MV/cm (annealing) and these values were higher than critical electric fields at breakdown in bulk Si (~0.3 MV/cm) and in Si-based one-sided abrupt junction (~0.65 MV/cm).
Keyword (in Japanese) (See Japanese page) 
(in English) surface-activated bonding / Si / SiC / current-voltage characteristics / heterojunction / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 329, ED2013-68, pp. 21-25, Nov. 2013.
Paper # ED2013-68 
Date of Issue 2013-11-21 (ED, CPM, LQE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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Download PDF ED2013-68 CPM2013-127 LQE2013-103 Link to ES Tech. Rep. Archives: ED2013-68 CPM2013-127 LQE2013-103

Conference Information
Committee CPM LQE ED  
Conference Date 2013-11-28 - 2013-11-29 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English) Nitride and Compound Semiconductor Devices 
Paper Information
Registration To ED 
Conference Code 2013-11-CPM-LQE-ED 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Electrical properties of Si/SiC heterojunctions fabricated using surface-activated bonding 
Sub Title (in English)  
Keyword(1) surface-activated bonding  
Keyword(2) Si  
Keyword(3) SiC  
Keyword(4) current-voltage characteristics  
Keyword(5) heterojunction  
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Keyword(8)  
1st Author's Name Shota Nishida  
1st Author's Affiliation Osaka City University (Osaka City Univ.)
2nd Author's Name Jianbo Liang  
2nd Author's Affiliation Osaka City University (Osaka City Univ.)
3rd Author's Name Masashi Morimoto  
3rd Author's Affiliation Osaka City University (Osaka City Univ.)
4th Author's Name Naoteru Shigekawa  
4th Author's Affiliation Osaka City University (Osaka City Univ.)
5th Author's Name Manabu Arai  
5th Author's Affiliation New Japan Radio Co. (New Japan Radio)
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Speaker Author-1 
Date Time 2013-11-28 13:30:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2013-68, CPM2013-127, LQE2013-103 
Volume (vol) vol.113 
Number (no) no.329(ED), no.330(CPM), no.331(LQE) 
Page pp.21-25 
#Pages
Date of Issue 2013-11-21 (ED, CPM, LQE) 


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