IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2013-12-17 11:00
Visualization technology of insulated copper wire snapping implemented with THz wave
Seiya Takahashi, Yuta Nakamura, Tadao Tanabe, Kensaku Maeda, Kaori Nakajima, Tomoyuki Hamano, Yutaka Oyama (Tohoku Univ.) ED2013-104 Link to ES Tech. Rep. Archives: ED2013-104
Abstract (in Japanese) (See Japanese page) 
(in English) A novel non-destructive inspection method using terahertz waves for the detection of broken wires in copper cables shielded by insulating polymer opaque in the visible and near infrared light region is presented. Terahertz reflection imaging, using a 0.14THz IMPATT oscillator and a Schottky barrier detector, was applied to insulated copper cables that had been artificially damaged. The internal wires embedded in the opaque polyethylene can be clearly visualized using THz radiation. It was shown that a gap in a wire can be detected by a decrease in the intensity of the reflected signal where the size of the gap is greater than the wavelength of the oscillator.
Keyword (in Japanese) (See Japanese page) 
(in English) THz wave / Imaging / Copper wire / Non-destructive inspection / / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 357, ED2013-104, pp. 81-86, Dec. 2013.
Paper # ED2013-104 
Date of Issue 2013-12-09 (ED) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2013-104 Link to ES Tech. Rep. Archives: ED2013-104

Conference Information
Committee ED  
Conference Date 2013-12-16 - 2013-12-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Research Institute of Electrical Communication Tohoku University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Millimeter wave, terahertz wave devices and systems 
Paper Information
Registration To ED 
Conference Code 2013-12-ED 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Visualization technology of insulated copper wire snapping implemented with THz wave 
Sub Title (in English)  
Keyword(1) THz wave  
Keyword(2) Imaging  
Keyword(3) Copper wire  
Keyword(4) Non-destructive inspection  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Seiya Takahashi  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Yuta Nakamura  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Tadao Tanabe  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Kensaku Maeda  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Kaori Nakajima  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Tomoyuki Hamano  
6th Author's Affiliation Tohoku University (Tohoku Univ.)
7th Author's Name Yutaka Oyama  
7th Author's Affiliation Tohoku University (Tohoku Univ.)
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2013-12-17 11:00:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2013-104 
Volume (vol) vol.113 
Number (no) no.357 
Page pp.81-86 
#Pages
Date of Issue 2013-12-09 (ED) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan