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| Presentation | 2014-02-28 15:20 [Invited Talk] TSV Liner Formation with Vapor Deposited Polyimides Takafumi Fukushima, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Mitsumasa Koyanagi (Tohoku Univ.)  SDM2013-172 Link to ES Tech. Rep. Archives: SDM2013-172 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | A Kapton insulation layer as a TSV liner was conformably formed by vapor deposition polymerization with pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) along deep Si vias at 200°C. The step coverages were approximately 75%, 80%, and 100% when we used the vias with diameters of 5μm, 10μm, and 15μm, respectively. The thicknesses ranging from 100 nm or below to 2000 nm or above were controllable. In addition, the polyimide TSV liner was stable at 380°C, where no vaporized molecules were observed from a TDS analysis. 5-μm-diameter fine Cu-TSVs (aspect ratio: > 8) with the polyimide liner were successfully formed by bottom-up electroplating. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Through-Silicon Via / TSV Liner / Polyimide / Vapor Deposition Polymerization / 3D LSI / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 113, no. 451, SDM2013-172, pp. 39-42, Feb. 2014. | |
| Paper # | SDM2013-172 | |
| Date of Issue | 2014-02-21 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2013-172 Link to ES Tech. Rep. Archives: SDM2013-172 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2014-02-28 - 2014-02-28 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2014-02-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | TSV Liner Formation with Vapor Deposited Polyimides |
| Sub Title (in English) | |
| Keyword(1) | Through-Silicon Via |
| Keyword(2) | TSV Liner |
| Keyword(3) | Polyimide |
| Keyword(4) | Vapor Deposition Polymerization |
| Keyword(5) | 3D LSI |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Takafumi Fukushima |
| 1st Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 2nd Author's Name | Mariappan Murugesan |
| 2nd Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 3rd Author's Name | Jicheol Bea |
| 3rd Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 4th Author's Name | Kangwook Lee |
| 4th Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 5th Author's Name | Mitsumasa Koyanagi |
| 5th Author's Affiliation | Tohoku University (Tohoku Univ.) |
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| Speaker | Author-1 |
| Date Time | 2014-02-28 15:20:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2013-172 |
| Volume (vol) | vol.113 |
| Number (no) | no.451 |
| Page | pp.39-42 |
| #Pages | 4 |
| Date of Issue | 2014-02-21 (SDM) |
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