Paper Abstract and Keywords |
Presentation |
2014-03-16 09:50
Voltage control considering the chip temperature in the three-dimensional stacked multi-core processors Yu Fujita, Yusuke Koizumi, Rie Uno, Hideharu Amano (Keio Univ.) CPSY2013-109 DC2013-96 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Cube-1 is a prototype heterogeneous multiprocessor using inductive coupling wireless TCI (Through Chip Interface). Since intermediate chips in the stack are separated from the air and print circuit board, the thermal of the chip tends to be separated from others. In order to control the supply voltage of such chips sand-witched by the other chips, a leak monitor embedded in the chip is utilized. If the leakage current of the chip becomes too large, the power of the chip is shut down in order to avoid the thermal run-away. Also, by measuring the temperature precisely from the leak monitor, we can lower the supply voltage so that the delay with the measured temperature satisfies the programmed delay. By using this method, energy efficiency can be improved by 5% at maximum. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
3D stacked multi-core processors / Voltage control / / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 113, no. 497, CPSY2013-109, pp. 241-246, March 2014. |
Paper # |
CPSY2013-109 |
Date of Issue |
2014-03-08 (CPSY, DC) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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CPSY2013-109 DC2013-96 |
Conference Information |
Committee |
CPSY IPSJ-EMB IPSJ-SLDM DC |
Conference Date |
2014-03-15 - 2014-03-16 |
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(See Japanese page) |
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Paper Information |
Registration To |
CPSY |
Conference Code |
2014-03-CPSY-EMB-SLDM-DC |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Voltage control considering the chip temperature in the three-dimensional stacked multi-core processors |
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Keyword(1) |
3D stacked multi-core processors |
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Voltage control |
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1st Author's Name |
Yu Fujita |
1st Author's Affiliation |
Keio University (Keio Univ.) |
2nd Author's Name |
Yusuke Koizumi |
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Keio University (Keio Univ.) |
3rd Author's Name |
Rie Uno |
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Keio University (Keio Univ.) |
4th Author's Name |
Hideharu Amano |
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Keio University (Keio Univ.) |
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Speaker |
Author-1 |
Date Time |
2014-03-16 09:50:00 |
Presentation Time |
25 minutes |
Registration for |
CPSY |
Paper # |
CPSY2013-109, DC2013-96 |
Volume (vol) |
vol.113 |
Number (no) |
no.497(CPSY), no.498(DC) |
Page |
pp.241-246 |
#Pages |
6 |
Date of Issue |
2014-03-08 (CPSY, DC) |
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