Paper Abstract and Keywords |
Presentation |
2014-06-13 15:10
Copper bonding technology using low-temperature decomposition compound Daisuke Horikawa, Atsushi Yamamoto, Yuji Hisazato, Yo Sasaki, Rieko Mizuuchi (Toshiba) R2014-13 |
Abstract |
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(in English) |
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Reference Info. |
IEICE Tech. Rep., vol. 114, no. 78, R2014-13, pp. 25-29, June 2014. |
Paper # |
R2014-13 |
Date of Issue |
2014-06-06 (R) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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R2014-13 |
Conference Information |
Committee |
R |
Conference Date |
2014-06-13 - 2014-06-13 |
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Paper Information |
Registration To |
R |
Conference Code |
2014-06-R |
Language |
Japanese |
Title (in Japanese) |
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Title (in English) |
Copper bonding technology using low-temperature decomposition compound |
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1st Author's Name |
Daisuke Horikawa |
1st Author's Affiliation |
TOSHIBA CORPORATION (Toshiba) |
2nd Author's Name |
Atsushi Yamamoto |
2nd Author's Affiliation |
TOSHIBA CORPORATION (Toshiba) |
3rd Author's Name |
Yuji Hisazato |
3rd Author's Affiliation |
TOSHIBA CORPORATION (Toshiba) |
4th Author's Name |
Yo Sasaki |
4th Author's Affiliation |
TOSHIBA CORPORATION (Toshiba) |
5th Author's Name |
Rieko Mizuuchi |
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TOSHIBA CORPORATION (Toshiba) |
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Speaker |
Author-1 |
Date Time |
2014-06-13 15:10:00 |
Presentation Time |
25 minutes |
Registration for |
R |
Paper # |
R2014-13 |
Volume (vol) |
vol.114 |
Number (no) |
no.78 |
Page |
pp.25-29 |
#Pages |
5 |
Date of Issue |
2014-06-06 (R) |
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