Paper Abstract and Keywords |
Presentation |
2014-10-31 16:05
[Invited Talk]
8 x 50-Gb/s EADFB laser array module using flip-chip interconnection technique Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Hiroyuki Ishii (NTT) OCS2014-82 OPE2014-126 LQE2014-100 Link to ES Tech. Rep. Archives: OPE2014-126 LQE2014-100 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We developed the first flip-chip interconnection EADFB laser array module for 400G system. The flip-chip interconnection technique yields lower crosstalk and higher modulation bandwidth compared to conventional wire interconnection technique. With flip-chip interconnection module, there was no rapid degradation of the E/O response under 35 GHz. And after 10-km transmission, the clear eye openings for all eight lanes were observed under 8-channel simultaneous operation. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
EADFB laser / flip-chip / Ethernet / 400GbE / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 114, no. 283, LQE2014-100, pp. 211-214, Oct. 2014. |
Paper # |
LQE2014-100 |
Date of Issue |
2014-10-23 (OCS, OPE, LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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Download PDF |
OCS2014-82 OPE2014-126 LQE2014-100 Link to ES Tech. Rep. Archives: OPE2014-126 LQE2014-100 |
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