Paper Abstract and Keywords |
Presentation |
2014-12-19 11:05
Optical transmission between III-V chips on Si by using photonic wire bonding Gu Zhichen, Tomohiro Amemiya (Tokyo Tech.), Atsushi Ishikawa (RIKEN), Yuki Atsumi (AIST), Kang Junhyung, Takuo Hiratani, Yusuke Hayashi, Junichi Suzuki, Nobuhiko Nishiyama (Tokyo Tech.), Takuo Tanaka (RIKEN), Shigehisa Arai (Tokyo Tech.) OPE2014-143 LQE2014-130 Link to ES Tech. Rep. Archives: OPE2014-143 LQE2014-130 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In this paper, we present some design considerations and fabrication process of photonic wire bonding (PWB) based on two-photon polymerization of ultraviolet curable resin SU-8 to achieve flexible chip scale optical interconnection. Firstly, we figured out the fabrication conditions of PWB regarding two photon absorption process excited by femtosecond laser and we numerically simulated the coupling structure between PWB and III-V optical component in order to obtain high coupling efficiency. By using the PWB, we realized a chip-to-chip optical transmission between laser and detector chips which were located on a Si substrate. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Optical interconnection / Femtosecond Laser / Compound Semiconductors / Integrated Optics / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 114, no. 377, OPE2014-143, pp. 21-26, Dec. 2014. |
Paper # |
OPE2014-143 |
Date of Issue |
2014-12-11 (OPE, LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
OPE2014-143 LQE2014-130 Link to ES Tech. Rep. Archives: OPE2014-143 LQE2014-130 |
|