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Paper Abstract and Keywords
Presentation 2015-01-23 10:15
A Vialess Open-stub EBG Structure for Power-bus Noise Reduction
Yuki Yamashita, Yoshitaka Toyota, Kengo Iokibe (Okayama Univ.), Koichi Kondo, Shigeyoshi Yoshida (NEC TOKIN), Toshiyuki Kaneko (KCS) EMCJ2014-95
Abstract (in Japanese) (See Japanese page) 
(in English) Electromagnetic bandgap (EBG) formed by a periodic structure (EBG structure) has been studied for reducing power-bus noise of printed circuit boards.
The EBG structure obtains a large amount of noise suppression and is available for separating simultaneous switching noise generated in digital circuits and small rf signal in analog circuits on mixed-signal boards.
Many kinds of EBG structures have been so far proposed and can be roughly classified into two types with and without vias.
We have focused on Planar EBG structures without vias because they consist of only two layers and cost-effective due to no vias.
In contrast, open-stub EBG structure, which is one of EBG structures with vias, is easy to miniaturize its cell size independently of suppression frequency.
We considered that the open-stub EBG structure was specialized for the EBG structures with vias.
In this report, however, a planer EBG structure with open stub is proposed by inventing a new structure.
The effect of power-bus noise reduction is examined by full-wave simulation and validated in the 2.4 GHz band.
Keyword (in Japanese) (See Japanese page) 
(in English) PCB / power bus / parallel plate resonance / planar EBG structure / open stub / noise reduction / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 398, EMCJ2014-95, pp. 57-62, Jan. 2015.
Paper # EMCJ2014-95 
Date of Issue 2015-01-15 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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Conference Information
Committee EMCJ WPT  
Conference Date 2015-01-22 - 2015-01-23 
Place (in Japanese) (See Japanese page) 
Place (in English) Okinawaken Jichikaikan 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Communication, Wireless Power Transmission, EMC, etc. 
Paper Information
Registration To EMCJ 
Conference Code 2015-01-EMCJ-WPT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Vialess Open-stub EBG Structure for Power-bus Noise Reduction 
Sub Title (in English)  
Keyword(1) PCB  
Keyword(2) power bus  
Keyword(3) parallel plate resonance  
Keyword(4) planar EBG structure  
Keyword(5) open stub  
Keyword(6) noise reduction  
Keyword(7)  
Keyword(8)  
1st Author's Name Yuki Yamashita  
1st Author's Affiliation Okayama University (Okayama Univ.)
2nd Author's Name Yoshitaka Toyota  
2nd Author's Affiliation Okayama University (Okayama Univ.)
3rd Author's Name Kengo Iokibe  
3rd Author's Affiliation Okayama University (Okayama Univ.)
4th Author's Name Koichi Kondo  
4th Author's Affiliation NEC TOKIN Corporation (NEC TOKIN)
5th Author's Name Shigeyoshi Yoshida  
5th Author's Affiliation NEC TOKIN Corporation (NEC TOKIN)
6th Author's Name Toshiyuki Kaneko  
6th Author's Affiliation KYOCERA Circuit Solutions, Inc. (KCS)
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Speaker Author-1 
Date Time 2015-01-23 10:15:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2014-95 
Volume (vol) vol.114 
Number (no) no.398 
Page pp.57-62 
#Pages
Date of Issue 2015-01-15 (EMCJ) 


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