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| Presentation | 2015-08-27 14:15 [Invited Talk] Heterogeneous Integration Technology Using Fluidic Self Assembly Based on Ga Molten Bumps Koichi Maezawa, Jun Nakano, Tomoaki Shibata, Hiroki Morita, Hiroshi Sakamoto, Satoshi Yamada, Masayuki Mori (Univ. Toyama)  R2015-28 EMD2015-36 CPM2015-52 OPE2015-67 LQE2015-36 Link to ES Tech. Rep. Archives: EMD2015-36 CPM2015-52 OPE2015-67 LQE2015-36 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Fluidic Self Assembly (FSA) is a most promising heterogeneous integration technique leading to new applications of semiconductor devices. The FSA is a highly exible technique, where scattered small device blocks are arranged into the recesses on the host substrate placed in fluid. Recently, we proposed a novele FSA employing capillary force of the molten Ga bumps. In this paper, we describe the features, applications, and the reliablity of the FSA based on our research. Moreover, application of this technique to micro/millimeter wave integrated circuits is discussed. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | heterogeneous integration / InP / InGaAs / uidic self assembly / resonant tunneling diode / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 115, no. 194, R2015-28, pp. 27-32, Aug. 2015. | |
| Paper # | R2015-28 | |
| Date of Issue | 2015-08-20 (R, EMD, CPM, OPE, LQE) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | R2015-28 EMD2015-36 CPM2015-52 OPE2015-67 LQE2015-36 Link to ES Tech. Rep. Archives: EMD2015-36 CPM2015-52 OPE2015-67 LQE2015-36 |
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| Conference Information | |
| Committee | CPM OPE LQE R EMD |
| Conference Date | 2015-08-27 - 2015-08-28 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Aomori-Bussankan-Asupamu |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | R |
| Conference Code | 2015-08-CPM-OPE-LQE-R-EMD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Heterogeneous Integration Technology Using Fluidic Self Assembly Based on Ga Molten Bumps |
| Sub Title (in English) | |
| Keyword(1) | heterogeneous integration |
| Keyword(2) | InP |
| Keyword(3) | InGaAs |
| Keyword(4) | uidic self assembly |
| Keyword(5) | resonant tunneling diode |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Koichi Maezawa |
| 1st Author's Affiliation | University of Toyama (Univ. Toyama) |
| 2nd Author's Name | Jun Nakano |
| 2nd Author's Affiliation | University of Toyama (Univ. Toyama) |
| 3rd Author's Name | Tomoaki Shibata |
| 3rd Author's Affiliation | University of Toyama (Univ. Toyama) |
| 4th Author's Name | Hiroki Morita |
| 4th Author's Affiliation | University of Toyama (Univ. Toyama) |
| 5th Author's Name | Hiroshi Sakamoto |
| 5th Author's Affiliation | University of Toyama (Univ. Toyama) |
| 6th Author's Name | Satoshi Yamada |
| 6th Author's Affiliation | University of Toyama (Univ. Toyama) |
| 7th Author's Name | Masayuki Mori |
| 7th Author's Affiliation | University of Toyama (Univ. Toyama) |
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| Speaker | Author-1 |
| Date Time | 2015-08-27 14:15:00 |
| Presentation Time | 35 minutes |
| Registration for | R |
| Paper # | R2015-28, EMD2015-36, CPM2015-52, OPE2015-67, LQE2015-36 |
| Volume (vol) | vol.115 |
| Number (no) | no.194(R), no.195(EMD), no.196(CPM), no.197(OPE), no.198(LQE) |
| Page | pp.27-32 |
| #Pages | 6 |
| Date of Issue | 2015-08-20 (R, EMD, CPM, OPE, LQE) |
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