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| Presentation | 2016-03-11 15:30 Study of crosstalk between ground slot and lines in PCB with 3 layers. Teruo Tobana, Takayuki Sasamori, Yoji Isota (Akita Pref. Univ.)  EMCJ2015-132 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Recently, by advance of miniaturization of electronic devices, a ground of a printed circuit board is tend to be small and complicated and the ground may have some defects, such as connectors or clearance halls of vias. In this paper, we calculated electromagnetic coupling between microstrip lines on different layers in 3 layers printed circuit board with a narrow slot which is on the ground using multi-conductor transmission line method. In order to calculate some electromagnetic coupling, per-unit-length parameters between the slot and the microstrip line are calculated using the spectral domain method. In this paper, we showed that electromagnetic coupling between lines on different layers through a ground slot is calculated using MTL method. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | coupling / multiconductor-transmission-line / ground slot / three layers PCB / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 115, no. 509, EMCJ2015-132, pp. 45-50, March 2016. | |
| Paper # | EMCJ2015-132 | |
| Date of Issue | 2016-03-04 (EMCJ) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | EMCJ2015-132 |
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| Conference Information | |
| Committee | EMCJ |
| Conference Date | 2016-03-11 - 2016-03-11 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | EMC |
| Paper Information | |
| Registration To | EMCJ |
| Conference Code | 2016-03-EMCJ |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study of crosstalk between ground slot and lines in PCB with 3 layers. |
| Sub Title (in English) | |
| Keyword(1) | coupling |
| Keyword(2) | multiconductor-transmission-line |
| Keyword(3) | ground slot |
| Keyword(4) | three layers PCB |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Teruo Tobana |
| 1st Author's Affiliation | Akita Prefectural University (Akita Pref. Univ.) |
| 2nd Author's Name | Takayuki Sasamori |
| 2nd Author's Affiliation | Akita Prefectural University (Akita Pref. Univ.) |
| 3rd Author's Name | Yoji Isota |
| 3rd Author's Affiliation | Akita Prefectural University (Akita Pref. Univ.) |
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| Speaker | Author-1 |
| Date Time | 2016-03-11 15:30:00 |
| Presentation Time | 25 minutes |
| Registration for | EMCJ |
| Paper # | EMCJ2015-132 |
| Volume (vol) | vol.115 |
| Number (no) | no.509 |
| Page | pp.45-50 |
| #Pages | 6 |
| Date of Issue | 2016-03-04 (EMCJ) |
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