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| Presentation | 2016-06-17 15:30 Thermal Analysis in 3D ICs Kaoru Furumi, Masashi Imai, Nanako Niioka, Atsushi Kurokawa (Hirosaki Univ.)  CAS2016-32 VLD2016-38 SIP2016-66 MSS2016-32 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Three-dimensional integrated circuits (3D ICs) lead to higher power densities than 2D ICs because of the stacking of multiple device layers. Thermal issue is one of the critical challenges in the field of 3D ICs. Since temperature affects signal delay and chip reliability, it is very important to clarify the impacts of various parameters on the maximum temperature in a 3D IC. In this report, we present several useful results obtained by thermal analysis with varying physical and material parameters of through-silicon-via (TSV) based 3D ICs. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Thermal Analysis / 3D IC / Through Silicon Vias (TSVs) / Heat Sink / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 116, no. 94, VLD2016-38, pp. 173-178, June 2016. | |
| Paper # | VLD2016-38 | |
| Date of Issue | 2016-06-09 (CAS, VLD, SIP, MSS) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | CAS2016-32 VLD2016-38 SIP2016-66 MSS2016-32 |
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| Conference Information | |
| Committee | VLD CAS MSS SIP |
| Conference Date | 2016-06-16 - 2016-06-17 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hirosaki Shiritsu Kanko-kan |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | System, signal processing and related topics |
| Paper Information | |
| Registration To | VLD |
| Conference Code | 2016-06-VLD-CAS-MSS-SIP |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Thermal Analysis in 3D ICs |
| Sub Title (in English) | |
| Keyword(1) | Thermal Analysis |
| Keyword(2) | 3D IC |
| Keyword(3) | Through Silicon Vias (TSVs) |
| Keyword(4) | Heat Sink |
| Keyword(5) | |
| Keyword(6) | |
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| Keyword(8) | |
| 1st Author's Name | Kaoru Furumi |
| 1st Author's Affiliation | Hirosaki University (Hirosaki Univ.) |
| 2nd Author's Name | Masashi Imai |
| 2nd Author's Affiliation | Hirosaki University (Hirosaki Univ.) |
| 3rd Author's Name | Nanako Niioka |
| 3rd Author's Affiliation | Hirosaki University (Hirosaki Univ.) |
| 4th Author's Name | Atsushi Kurokawa |
| 4th Author's Affiliation | Hirosaki University (Hirosaki Univ.) |
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| Speaker | Author-1 |
| Date Time | 2016-06-17 15:30:00 |
| Presentation Time | 20 minutes |
| Registration for | VLD |
| Paper # | CAS2016-32, VLD2016-38, SIP2016-66, MSS2016-32 |
| Volume (vol) | vol.116 |
| Number (no) | no.93(CAS), no.94(VLD), no.95(SIP), no.96(MSS) |
| Page | pp.173-178 |
| #Pages | 6 |
| Date of Issue | 2016-06-09 (CAS, VLD, SIP, MSS) |
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