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| Presentation | 2017-02-06 16:10 [Invited Talk] Direct Cu metallization on TGV Glass substrate using Wet Process. Kotoku Inoue, Masatoshi Takayama, Tsubasa Fujimura, Shigeo Onitake (Koto)  SDM2016-146 Link to ES Tech. Rep. Archives: SDM2016-146 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | It is believed that conformal metallization or via filling on glass with the highly conductive thick Cu material is expected to enhance the performance for RF electronic devices in the IoT era due to the outstanding RF properties of the glass and high-Q nature of Cu metallization. Previously, metallization on the glass with sputtering and printing technology has been demonstrated. However, there are some concerns in terms of throughput and mechanical integrity of sputter seed layer for Cu metallization on TGV (thru-glass via) sidewalls and the smooth glass surfaces. This study reports our novel metallization technology to obtain good adhesion without degrading the RF performance associated with glass properties and Cu conductivity. Metal circuits including high-Q RF inductors were created without roughening the surface of glass substrate by wet plating process with subtractive process. Surface cleaning is critical to obtain good adhesion. In this experiment, glass surface was cleaned by the irradiation of UV light and alkaline degreasing with complex agent. UV light and alkaline degreasing make the surface of the glass clean and the Cu adhesion to glass improve with minimal stress to the glass itself. We have successfully demonstrated direct cupper plating on TGV holes with filling via and conformal plating for RF front end filters with better performance (Cu – glass adhesion 0.4kN/m). This technology is further optimized for high-performance RF standalone passive network and RF interposers with the capability of thick (15um) Cu plating directly on TGV glass for the first time in 300mm x 400mm x 0.4mm thick panel format, targeting low-cost and high-throughput TGV metallization. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Glass / Cu plating / Through glass via hole / TGV / Direct Cu plating on glass / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 116, no. 450, SDM2016-146, pp. 41-44, Feb. 2017. | |
| Paper # | SDM2016-146 | |
| Date of Issue | 2017-01-30 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2016-146 Link to ES Tech. Rep. Archives: SDM2016-146 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2017-02-06 - 2017-02-06 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tokyo Univ. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Interconnects, Package and related materials |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2017-02-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Direct Cu metallization on TGV Glass substrate using Wet Process. |
| Sub Title (in English) | |
| Keyword(1) | Glass |
| Keyword(2) | Cu plating |
| Keyword(3) | Through glass via hole |
| Keyword(4) | TGV |
| Keyword(5) | Direct Cu plating on glass |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Kotoku Inoue |
| 1st Author's Affiliation | Koto electric co.,Ltd. (Koto) |
| 2nd Author's Name | Masatoshi Takayama |
| 2nd Author's Affiliation | Koto electric co.,Ltd. (Koto) |
| 3rd Author's Name | Tsubasa Fujimura |
| 3rd Author's Affiliation | Koto electric co.,Ltd. (Koto) |
| 4th Author's Name | Shigeo Onitake |
| 4th Author's Affiliation | Koto electric co.,Ltd. (Koto) |
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| Speaker | Author-1 |
| Date Time | 2017-02-06 16:10:00 |
| Presentation Time | 35 minutes |
| Registration for | SDM |
| Paper # | SDM2016-146 |
| Volume (vol) | vol.116 |
| Number (no) | no.450 |
| Page | pp.41-44 |
| #Pages | 4 |
| Date of Issue | 2017-01-30 (SDM) |
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