IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-10-26 09:30
[Invited Talk] Utilization of Big Data for Innovation in Semiconductor Memory Manufacturing -- Comprehensive Big-Data-Based Monitoring System for Yield Analysis in Semiconductor Manufacturing --
Hiroshi Akahori (Toshiba Memory), Kouta Nakata, Ryohei Orihara, Yoshiaki Mizuoka, Kentaro Takagi (Toshiba), Kenichi Kadota, Takaharu Nishimura, Yukako Tanaka, Hidetaka Eguchi (Toshiba Memory) SDM2017-55 Link to ES Tech. Rep. Archives: SDM2017-55
Abstract (in Japanese) (See Japanese page) 
(in English) In this work, we focus on yield analysis task where engineers identify the cause of failure from wafer failure map patterns and manufacturing histories. We organize yield analysis task into 3 stages, failure map pattern monitoring, failure cause identification and failure recurrence monitoring, and incorporate machine learning and data mining technologies into each stage to support engineers' work. The important point is that big data analysis enables comprehensive and long-term monitoring automation. Machine learning and data mining techniques are integrated into a real automated monitoring system with interfaces familiar to engineers to attain large yield enhancement.
Keyword (in Japanese) (See Japanese page) 
(in English) Big-Data / Semiconductor / Yield Analysis / Machine Learning / Data Mining / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 260, SDM2017-55, pp. 31-33, Oct. 2017.
Paper # SDM2017-55 
Date of Issue 2017-10-18 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2017-55 Link to ES Tech. Rep. Archives: SDM2017-55

Conference Information
Committee SDM  
Conference Date 2017-10-25 - 2017-10-26 
Place (in Japanese) (See Japanese page) 
Place (in English) Niche, Tohoku Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process Science and New Process Technology 
Paper Information
Registration To SDM 
Conference Code 2017-10-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Utilization of Big Data for Innovation in Semiconductor Memory Manufacturing 
Sub Title (in English) Comprehensive Big-Data-Based Monitoring System for Yield Analysis in Semiconductor Manufacturing 
Keyword(1) Big-Data  
Keyword(2) Semiconductor  
Keyword(3) Yield Analysis  
Keyword(4) Machine Learning  
Keyword(5) Data Mining  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hiroshi Akahori  
1st Author's Affiliation Toshiba Memory Corporation (Toshiba Memory)
2nd Author's Name Kouta Nakata  
2nd Author's Affiliation Toshiba Corporation (Toshiba)
3rd Author's Name Ryohei Orihara  
3rd Author's Affiliation Toshiba Corporation (Toshiba)
4th Author's Name Yoshiaki Mizuoka  
4th Author's Affiliation Toshiba Corporation (Toshiba)
5th Author's Name Kentaro Takagi  
5th Author's Affiliation Toshiba Corporation (Toshiba)
6th Author's Name Kenichi Kadota  
6th Author's Affiliation Toshiba Memory Corporation (Toshiba Memory)
7th Author's Name Takaharu Nishimura  
7th Author's Affiliation Toshiba Memory Corporation (Toshiba Memory)
8th Author's Name Yukako Tanaka  
8th Author's Affiliation Toshiba Memory Corporation (Toshiba Memory)
9th Author's Name Hidetaka Eguchi  
9th Author's Affiliation Toshiba Memory Corporation (Toshiba Memory)
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2017-10-26 09:30:00 
Presentation Time 50 minutes 
Registration for SDM 
Paper # SDM2017-55 
Volume (vol) vol.117 
Number (no) no.260 
Page pp.31-33 
#Pages
Date of Issue 2017-10-18 (SDM) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan