Paper Abstract and Keywords |
Presentation |
2020-08-06 13:50
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) SDM2020-5 ICD2020-5 Link to ES Tech. Rep. Archives: SDM2020-5 ICD2020-5 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
A 2.5D structure with a Si interposer stacked on a CMOS chip is developed to reduce power supply impedance. A backside buried metal (BBM) in Si interposer provides low resistive wiring of power / ground nodes and also forms a large parasitic bypass capacitance between power and ground patterns, which drastically suppresses the power supply noise. The Si interposer was implemented over a cryptographic chip with a large scale digital circuit fabricated in 130 nm CMOS. The measured resistance values of power and ground line were reduced by 30% and 56%, respectively, and the measured bypass capacitance was increased by 2.4 nF, owing to the additional low resistive wiring in parallel and a large parasitic capacitance of the Si interposer and the stacking structure itself. An internal noise monitoring circuit embedded in the CMOS chip indicates that the proposed over-the-top Si interposer reduces a peak-to-peak power supply noise and DC drop during cryptographic operation to less than 50%. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
2.5D implementation / Si interposer / Power supply impedance / Cryptographic circuit / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 120, no. 127, ICD2020-5, pp. 19-24, Aug. 2020. |
Paper # |
ICD2020-5 |
Date of Issue |
2020-07-30 (SDM, ICD) |
ISSN |
Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
SDM2020-5 ICD2020-5 Link to ES Tech. Rep. Archives: SDM2020-5 ICD2020-5 |
Conference Information |
Committee |
ICD SDM ITE-IST |
Conference Date |
2020-08-06 - 2020-08-07 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Online |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications |
Paper Information |
Registration To |
ICD |
Conference Code |
2020-08-ICD-SDM-IST |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance |
Sub Title (in English) |
|
Keyword(1) |
2.5D implementation |
Keyword(2) |
Si interposer |
Keyword(3) |
Power supply impedance |
Keyword(4) |
Cryptographic circuit |
Keyword(5) |
|
Keyword(6) |
|
Keyword(7) |
|
Keyword(8) |
|
1st Author's Name |
Takuji Miki |
1st Author's Affiliation |
Kobe University (Kobe Univ.) |
2nd Author's Name |
Makoto Nagata |
2nd Author's Affiliation |
Kobe University (Kobe Univ.) |
3rd Author's Name |
Akihiro Tsukioka |
3rd Author's Affiliation |
Kobe University (Kobe Univ.) |
4th Author's Name |
Noriyuki Miura |
4th Author's Affiliation |
Osaka University (Osaka Univ.) |
5th Author's Name |
Takaaki Okidono |
5th Author's Affiliation |
ECSEC (ECSEC) |
6th Author's Name |
Yuuki Araga |
6th Author's Affiliation |
AIST (AIST) |
7th Author's Name |
Naoya Watanabe |
7th Author's Affiliation |
AIST (AIST) |
8th Author's Name |
Haruo Shimamoto |
8th Author's Affiliation |
AIST (AIST) |
9th Author's Name |
Katsuya Kikuchi |
9th Author's Affiliation |
AIST (AIST) |
10th Author's Name |
|
10th Author's Affiliation |
() |
11th Author's Name |
|
11th Author's Affiliation |
() |
12th Author's Name |
|
12th Author's Affiliation |
() |
13th Author's Name |
|
13th Author's Affiliation |
() |
14th Author's Name |
|
14th Author's Affiliation |
() |
15th Author's Name |
|
15th Author's Affiliation |
() |
16th Author's Name |
|
16th Author's Affiliation |
() |
17th Author's Name |
|
17th Author's Affiliation |
() |
18th Author's Name |
|
18th Author's Affiliation |
() |
19th Author's Name |
|
19th Author's Affiliation |
() |
20th Author's Name |
|
20th Author's Affiliation |
() |
Speaker |
Author-1 |
Date Time |
2020-08-06 13:50:00 |
Presentation Time |
25 minutes |
Registration for |
ICD |
Paper # |
SDM2020-5, ICD2020-5 |
Volume (vol) |
vol.120 |
Number (no) |
no.126(SDM), no.127(ICD) |
Page |
pp.19-24 |
#Pages |
6 |
Date of Issue |
2020-07-30 (SDM, ICD) |
|