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Paper Abstract and Keywords
Presentation 2021-02-12 15:00
[Invited Talk] Reliability physics issues for electronic devices -- Failure mechanisms that still need to be physically clarified --
Yasushi Kadota (RICOH Co.,Ltd.) R2020-37 EMD2020-28
Abstract (in Japanese) (See Japanese page) 
(in English) Many kind of electronic devices, including semiconductor devices, have been using in various fields and applications in the market. The types of failures of electronic devices that occur in the market today are often caused by unexpected failures in special environments, usage methods, and processes. Therefore, one of the main concerns in reliability development is the identification of complex failure mechanisms caused by special environments and their combinations, and reliability programs that emphasize physical failure analysis, risk assessment, and complex environment testing are in operation. On the other hand, the technical issues of reliability physics related to individual failure mechanisms have not been resolved. For example, dielectric breakdown over time (TDDB) has not been completely clarified in terms of reliability physics, and some aspects are still being considered based on reliability test results and material property measurements. One of the main reasons for this is that it is difficult to detect the location of failures in short-circuit systems due to secondary failures, making it difficult for physical failure analysis to function in the micro region. As described above, technical issues related to the reliability physics of electronic devices still exist in various fields, and various technical activities will be necessary in the future.
Keyword (in Japanese) (See Japanese page) 
(in English) Reliability physics / Physical failure analysis / Lifetime prediction equation / Time dependent die electric breakdown / Eyring model / Ceramic polycrystalline film / /  
Reference Info. IEICE Tech. Rep., vol. 120, no. 360, R2020-37, pp. 19-24, Feb. 2021.
Paper # R2020-37 
Date of Issue 2021-02-05 (R, EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMD R  
Conference Date 2021-02-12 - 2021-02-12 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To R 
Conference Code 2021-02-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Reliability physics issues for electronic devices 
Sub Title (in English) Failure mechanisms that still need to be physically clarified 
Keyword(1) Reliability physics  
Keyword(2) Physical failure analysis  
Keyword(3) Lifetime prediction equation  
Keyword(4) Time dependent die electric breakdown  
Keyword(5) Eyring model  
Keyword(6) Ceramic polycrystalline film  
1st Author's Name Yasushi Kadota  
1st Author's Affiliation RICOH Company, Limited (RICOH Co.,Ltd.)
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Date Time 2021-02-12 15:00:00 
Presentation Time 45 
Registration for R 
Paper # R2020-37, EMD2020-28 
Volume (vol) 120 
Number (no) no.360(R), no.361(EMD) 
Page pp.19-24 
Date of Issue 2021-02-05 (R, EMD) 

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