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Presentation 2022-02-04 09:45
[Invited Talk] Advanced Damascene Integration with Self Assembled Monolayer (SAM)
Hiroyuki Nagai, Mitsuaki Iwashita, Yuki Kikuchi (TEL), Kawasaki Hiroaki, Gyana Pattanaik (TTCA), Keiichi Fujita (TKL), Kazutoshi Iwai (TEA), Hiroyuki Komatsu, Yuuki Ozaki (JSR) SDM2021-75 Link to ES Tech. Rep. Archives: SDM2021-75
Abstract (in Japanese) (See Japanese page) 
(in English) Selective deposition of Cu diffusion barrier metal layer on dielectric with Self-Assembled Monolayer (SAM) has been demonstrated. Via resistance is expected to decrease by eliminating the barrier at via bottom in dual- and semi-damascene structure. In this study, we report the evaluation of SAMs to enable selective ALD-barrier metal deposition and, as an example, we show Cu via prefill integration using ELD-Cu with no barrier / liner at via bottom and no seam void for metal filling.
Keyword (in Japanese) (See Japanese page) 
(in English) SAM / Prefill / ELD-Cu / / / / /  
Reference Info. IEICE Tech. Rep., vol. 121, no. 366, SDM2021-75, pp. 5-8, Feb. 2022.
Paper # SDM2021-75 
Date of Issue 2022-01-28 (SDM) 
ISSN Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2021-75 Link to ES Tech. Rep. Archives: SDM2021-75

Conference Information
Committee SDM  
Conference Date 2022-02-04 - 2022-02-04 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2022-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Advanced Damascene Integration with Self Assembled Monolayer (SAM) 
Sub Title (in English)  
Keyword(1) SAM  
Keyword(2) Prefill  
Keyword(3) ELD-Cu  
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1st Author's Name Hiroyuki Nagai  
1st Author's Affiliation Tokyo Electron Limited (TEL)
2nd Author's Name Mitsuaki Iwashita  
2nd Author's Affiliation Tokyo Electron Limited (TEL)
3rd Author's Name Yuki Kikuchi  
3rd Author's Affiliation Tokyo Electron Limited (TEL)
4th Author's Name Kawasaki Hiroaki  
4th Author's Affiliation TEL Technology Center, America, LLC (TTCA)
5th Author's Name Gyana Pattanaik  
5th Author's Affiliation TEL Technology Center, America, LLC (TTCA)
6th Author's Name Keiichi Fujita  
6th Author's Affiliation Tokyo Electron Kyushu Limited (TKL)
7th Author's Name Kazutoshi Iwai  
7th Author's Affiliation Tokyo Electron America, Inc. (TEA)
8th Author's Name Hiroyuki Komatsu  
8th Author's Affiliation JSR corporation (JSR)
9th Author's Name Yuuki Ozaki  
9th Author's Affiliation JSR corporation (JSR)
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Speaker Author-1 
Date Time 2022-02-04 09:45:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2021-75 
Volume (vol) vol.121 
Number (no) no.366 
Page pp.5-8 
#Pages
Date of Issue 2022-01-28 (SDM) 


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