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| Presentation | 2022-02-04 11:20 [Invited Talk] 3D Sequential Process Integration for CMOS Image Sensor Keiichi Nakazawa, Junpei Yamamoto, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Shigetaka Mori, Shintaro Okamoto, Akito Shimizu, Koichi Baba, Hidetoshi Onuma, Akira Matsumoto, Koichiro Zaitsu, Keiji Tanani, Tomoyuki Hirano, Hayato Iwamoto (Sony Semiconductor Solutions)  SDM2021-77 Link to ES Tech. Rep. Archives: SDM2021-77 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | We developed a new structure of pixel transistors stacked over photodiode named “2-Layer Transistor Pixel Stacked CMOS Image Sensor” (2-Layer Pixel). It was fabricated by 3D sequential process integration with new process techniques, such as thermally stable wafer bonding and deep contacts. With this technology, we successfully increased AMP size and demonstrated backside-illuminated CMOS image sensor of 6752 x 4928 pixels at 0.7um pitch to prove its functionality and integrity. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D Sequential / 2-Layer Pixel / wafer bonding / deep contact / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 121, no. 366, SDM2021-77, pp. 13-16, Feb. 2022. | |
| Paper # | SDM2021-77 | |
| Date of Issue | 2022-01-28 (SDM) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2021-77 Link to ES Tech. Rep. Archives: SDM2021-77 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2022-02-04 - 2022-02-04 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2022-02-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 3D Sequential Process Integration for CMOS Image Sensor |
| Sub Title (in English) | |
| Keyword(1) | 3D Sequential |
| Keyword(2) | 2-Layer Pixel |
| Keyword(3) | wafer bonding |
| Keyword(4) | deep contact |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Keiichi Nakazawa |
| 1st Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 2nd Author's Name | Junpei Yamamoto |
| 2nd Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 3rd Author's Name | Nobutoshi Fujii |
| 3rd Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 4th Author's Name | Mutsuo Uehara |
| 4th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 5th Author's Name | Katsunori Hiramatsu |
| 5th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 6th Author's Name | Hideomi Kumano |
| 6th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 7th Author's Name | Shigetaka Mori |
| 7th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 8th Author's Name | Shintaro Okamoto |
| 8th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 9th Author's Name | Akito Shimizu |
| 9th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 10th Author's Name | Koichi Baba |
| 10th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 11th Author's Name | Hidetoshi Onuma |
| 11th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 12th Author's Name | Akira Matsumoto |
| 12th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 13th Author's Name | Koichiro Zaitsu |
| 13th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 14th Author's Name | Keiji Tanani |
| 14th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 15th Author's Name | Tomoyuki Hirano |
| 15th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 16th Author's Name | Hayato Iwamoto |
| 16th Author's Affiliation | Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions) |
| 17th Author's Name | |
| 17th Author's Affiliation | () |
| 18th Author's Name | |
| 18th Author's Affiliation | () |
| Speaker | Author-2 |
| Date Time | 2022-02-04 11:20:00 |
| Presentation Time | 40 minutes |
| Registration for | SDM |
| Paper # | SDM2021-77 |
| Volume (vol) | vol.121 |
| Number (no) | no.366 |
| Page | pp.13-16 |
| #Pages | 4 |
| Date of Issue | 2022-01-28 (SDM) |
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