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Paper Abstract and Keywords
Presentation 2022-03-03 09:35
Chip Resistors for Heat Dissipation on RF circuits
Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Hidenori Yukawa, Toru Fukasawa, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric) MW2021-112
Abstract (in Japanese) (See Japanese page) 
(in English) In this paper we present that the technology of heat dissipation for RF circuit using chip resistors. The quarter wavelength short circuited stub is well known as heat dissipation means for RF circuit. The quarter wavelength short circuited stub has some problems. Since it needs quarter wavelength, it is not suitable for high-density mounting circuits. It is only available for around the center frequency. Therefore, we propose that the high resistance chip resistors for heat dissipation on RF circuits. Since chip resistor is made of ceramic that has good thermal conductivity, it can be available for the heat dissipation parts. In addition, the dielectric loss of the chip resistor is small. We compared the shot circuited stubs and the chip resistors with respect to RF characteristics and heat dissipation characteristics. In additions, we compared different size chip resistors.
Keyword (in Japanese) (See Japanese page) 
(in English) Quarter Wavelength Short Circuited Stub / Chip Resistor / Heat Dissipation / / / / /  
Reference Info. IEICE Tech. Rep., vol. 121, no. 400, MW2021-112, pp. 7-11, March 2022.
Paper # MW2021-112 
Date of Issue 2022-02-24 (MW) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2021-112

Conference Information
Committee MW  
Conference Date 2022-03-03 - 2022-03-04 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave, etc. 
Paper Information
Registration To MW 
Conference Code 2022-03-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Chip Resistors for Heat Dissipation on RF circuits 
Sub Title (in English)  
Keyword(1) Quarter Wavelength Short Circuited Stub  
Keyword(2) Chip Resistor  
Keyword(3) Heat Dissipation  
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1st Author's Name Yuta Sugiyama  
1st Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
2nd Author's Name Hidenori Ishibashi  
2nd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
3rd Author's Name Takeshi Oshima  
3rd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
4th Author's Name Hidenori Yukawa  
4th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
5th Author's Name Toru Fukasawa  
5th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
6th Author's Name Toru Takahashi  
6th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
7th Author's Name Yoshio Inasawa  
7th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
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Speaker Author-1 
Date Time 2022-03-03 09:35:00 
Presentation Time 20 minutes 
Registration for MW 
Paper # MW2021-112 
Volume (vol) vol.121 
Number (no) no.400 
Page pp.7-11 
#Pages
Date of Issue 2022-02-24 (MW) 


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