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| Presentation | 2022-03-03 09:35 Chip Resistors for Heat Dissipation on RF circuits Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Hidenori Yukawa, Toru Fukasawa, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric)  MW2021-112 Link to ES Tech. Rep. Archives: MW2021-112 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | In this paper we present that the technology of heat dissipation for RF circuit using chip resistors. The quarter wavelength short circuited stub is well known as heat dissipation means for RF circuit. The quarter wavelength short circuited stub has some problems. Since it needs quarter wavelength, it is not suitable for high-density mounting circuits. It is only available for around the center frequency. Therefore, we propose that the high resistance chip resistors for heat dissipation on RF circuits. Since chip resistor is made of ceramic that has good thermal conductivity, it can be available for the heat dissipation parts. In addition, the dielectric loss of the chip resistor is small. We compared the shot circuited stubs and the chip resistors with respect to RF characteristics and heat dissipation characteristics. In additions, we compared different size chip resistors. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Quarter Wavelength Short Circuited Stub / Chip Resistor / Heat Dissipation / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 121, no. 400, MW2021-112, pp. 7-11, March 2022. | |
| Paper # | MW2021-112 | |
| Date of Issue | 2022-02-24 (MW) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | MW2021-112 Link to ES Tech. Rep. Archives: MW2021-112 |
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| Conference Information | |
| Committee | MW |
| Conference Date | 2022-03-03 - 2022-03-04 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Microwave, etc. |
| Paper Information | |
| Registration To | MW |
| Conference Code | 2022-03-MW |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Chip Resistors for Heat Dissipation on RF circuits |
| Sub Title (in English) | |
| Keyword(1) | Quarter Wavelength Short Circuited Stub |
| Keyword(2) | Chip Resistor |
| Keyword(3) | Heat Dissipation |
| Keyword(4) | |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Yuta Sugiyama |
| 1st Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric) |
| 2nd Author's Name | Hidenori Ishibashi |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric) |
| 3rd Author's Name | Takeshi Oshima |
| 3rd Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric) |
| 4th Author's Name | Hidenori Yukawa |
| 4th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric) |
| 5th Author's Name | Toru Fukasawa |
| 5th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric) |
| 6th Author's Name | Toru Takahashi |
| 6th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric) |
| 7th Author's Name | Yoshio Inasawa |
| 7th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric) |
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| Speaker | Author-1 |
| Date Time | 2022-03-03 09:35:00 |
| Presentation Time | 20 minutes |
| Registration for | MW |
| Paper # | MW2021-112 |
| Volume (vol) | vol.121 |
| Number (no) | no.400 |
| Page | pp.7-11 |
| #Pages | 5 |
| Date of Issue | 2022-02-24 (MW) |
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