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Paper Abstract and Keywords
Presentation 2022-03-04 10:55
Reduction of radiated noise in the printed wiring board power supply layer -- Effect of resistance structure --
Shuitiro Kotaki, Sinichi Sasaki (Saga Univ) EMCJ2021-73
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, with the multi-functionalization of information devices, radiation noise by power supply noise waves in a circuit board generated by the high-speed operation of the mounted LSI is a problem. In this laboratory, a method is proposed to add resistance between the power supply layers at the end of the substrate and reduce noise. So far, it has been confirmed that the same resistance value as the characteristic impedance value of the line having the resistor addition pitch is effective. However, depending on the addition method and structure to the substrate end, the noise wave was not optimal resistance value. In this study, the purpose is to clarify the optimal resistance value due to the difference in addition method and structure. Currently, we are examining the case where the alignment resistance is added to the substrate end of the flat substrate and the circular substrate as a structure. As a result of the characteristic impedance evaluation by three-dimensional electrical field analysis so far, it was confirmed that there is a difference in the optimum value by the structure. In the future, we will investigate the resistance value effective for reducing radiation noise.
Keyword (in Japanese) (See Japanese page) 
(in English) Radiation noise / Characteristic impedance / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 121, no. 403, EMCJ2021-73, pp. 7-10, March 2022.
Paper # EMCJ2021-73 
Date of Issue 2022-02-25 (EMCJ) 
ISSN Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee MICT EMCJ  
Conference Date 2022-03-04 - 2022-03-04 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Healthcare and Medical Information Communication Technologies, EMC, etc 
Paper Information
Registration To EMCJ 
Conference Code 2022-03-MICT-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Reduction of radiated noise in the printed wiring board power supply layer 
Sub Title (in English) Effect of resistance structure 
Keyword(1) Radiation noise  
Keyword(2) Characteristic impedance  
1st Author's Name Shuitiro Kotaki  
1st Author's Affiliation Saga University Graduate School (Saga Univ)
2nd Author's Name Sinichi Sasaki  
2nd Author's Affiliation Saga University (Saga Univ)
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Speaker Author-1 
Date Time 2022-03-04 10:55:00 
Presentation Time 20 minutes 
Registration for EMCJ 
Paper # EMCJ2021-73 
Volume (vol) vol.121 
Number (no) no.403 
Page pp.7-10 
Date of Issue 2022-02-25 (EMCJ) 

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