IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2022-11-10 11:00
[Invited Talk] Optimum Design of Channel Material and Surface Orientation for Extremely-Thin-Body nMOSFETs under Nonlinear Modeling of Surface Roughness Scattering
Kei Sumita, Min-Soo Kang, Chia-Tsong Chen, Kasidit Toprasertpong, Mitsuru Takenaka, Shinichi Takagi (Univ. Tokyo) SDM2022-65
Abstract (in Japanese) (See Japanese page) 
(in English) Extremely-thin-body (ETB) channels are regarded as the most promising channel structure for future CMOS technology nodes. In parallel, CMOS operation at low temperatures is demanded for the quantum computing and data center applications. Here, surface roughness (SR) scattering is a dominant scattering mechanism for such ETB channels and at low temperature. However, there is a challenge for the conventional linear model of SR scattering that the excessive roughness parameters are used in the linear model to explain the experiments. In this study, we have proposed a new model of surface roughness scattering including the nonlinearity of SR scattering, which can explain the experimental mobility of SOI, GOI and InAs-OI nMOSFETs by using roughness parameters obtained experimentally from TEM images. The material and surface orientation in ETB channels is optimized by calculating the mobility based on our nonlinear model. As a result, the anisotropic valley with heavy confinement mass is essentially important to suppress the SR scattering because of the low quantization energy fluctuation. In particular, (111) GOI is most expected thanks to the strong anisotropic L valley and have the excellent SR-limited and phonon-limited electron mobility even in the 2-nm-thick channels, which is an advantage over 2D materials.
Keyword (in Japanese) (See Japanese page) 
(in English) Extremely-Thin-Body / Nanosheet / MOSFET / Surface Roughness Scattering / Mobility / / /  
Reference Info. IEICE Tech. Rep., vol. 122, no. 247, SDM2022-65, pp. 7-12, Nov. 2022.
Paper # SDM2022-65 
Date of Issue 2022-11-03 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2022-65

Conference Information
Committee SDM  
Conference Date 2022-11-10 - 2022-11-11 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process, Device, Circuit simulation, etc. 
Paper Information
Registration To SDM 
Conference Code 2022-11-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Optimum Design of Channel Material and Surface Orientation for Extremely-Thin-Body nMOSFETs under Nonlinear Modeling of Surface Roughness Scattering 
Sub Title (in English)  
Keyword(1) Extremely-Thin-Body  
Keyword(2) Nanosheet  
Keyword(3) MOSFET  
Keyword(4) Surface Roughness Scattering  
Keyword(5) Mobility  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Kei Sumita  
1st Author's Affiliation University of Tokyo (Univ. Tokyo)
2nd Author's Name Min-Soo Kang  
2nd Author's Affiliation University of Tokyo (Univ. Tokyo)
3rd Author's Name Chia-Tsong Chen  
3rd Author's Affiliation University of Tokyo (Univ. Tokyo)
4th Author's Name Kasidit Toprasertpong  
4th Author's Affiliation University of Tokyo (Univ. Tokyo)
5th Author's Name Mitsuru Takenaka  
5th Author's Affiliation University of Tokyo (Univ. Tokyo)
6th Author's Name Shinichi Takagi  
6th Author's Affiliation University of Tokyo (Univ. Tokyo)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2022-11-10 11:00:00 
Presentation Time 60 minutes 
Registration for SDM 
Paper # SDM2022-65 
Volume (vol) vol.122 
Number (no) no.247 
Page pp.7-12 
#Pages
Date of Issue 2022-11-03 (SDM) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan