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Paper Abstract and Keywords
Presentation 2023-01-20 11:25
Online junction temperature measurement of Power MOSFET by dynamic VGS-ID monitoring system
Yandagkhuu Bayarsaikhan, Ichiro Omura (KIT) EE2022-46
Abstract (in Japanese) (See Japanese page) 
(in English) As the demand for high reliability in power electronics systems increases, the online condition monitoring of power devices is becoming crucial. The junction temperature is a vital indicator of the reliability and health of the power semiconductor devices. Therefore, we developed a novel junction temperature measurement method via dynamic threshold voltage. The proposed method uses a specially designed PCB sensor for detecting a drain current and captures the dynamic gate-source voltage at predetermined drain current levels. The analog circuit was designed and experimentally verified by a double pulse test. A 16-bit ADC embedded in the microcontroller is utilized to digitize the captured voltage to demonstrate the monitoring system. The temperature sensitivity of the Power MOSFET was -2.2 mV/°C and was unaffected by the high side device temperature.
Keyword (in Japanese) (See Japanese page) 
(in English) MOSFET / Temperature measurement / Temperature monitoring / TSEP / Threshold voltage / Rogowski coil / PCB current sensor /  
Reference Info. IEICE Tech. Rep., vol. 122, no. 343, EE2022-46, pp. 111-116, Jan. 2023.
Paper # EE2022-46 
Date of Issue 2023-01-12 (EE) 
ISSN Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EE2022-46

Conference Information
Committee EE  
Conference Date 2023-01-19 - 2023-01-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kyushu Institute of Technology 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EE 
Conference Code 2023-01-EE 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Online junction temperature measurement of Power MOSFET by dynamic VGS-ID monitoring system 
Sub Title (in English)  
Keyword(1) MOSFET  
Keyword(2) Temperature measurement  
Keyword(3) Temperature monitoring  
Keyword(4) TSEP  
Keyword(5) Threshold voltage  
Keyword(6) Rogowski coil  
Keyword(7) PCB current sensor  
Keyword(8)  
1st Author's Name Yandagkhuu Bayarsaikhan  
1st Author's Affiliation Kyushu Institute of Technology (KIT)
2nd Author's Name Ichiro Omura  
2nd Author's Affiliation Kyushu Institute of Technology (KIT)
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Speaker Author-1 
Date Time 2023-01-20 11:25:00 
Presentation Time 25 minutes 
Registration for EE 
Paper # EE2022-46 
Volume (vol) vol.122 
Number (no) no.343 
Page pp.111-116 
#Pages
Date of Issue 2023-01-12 (EE) 


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