IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2023-04-15 10:45
PUF Based on Fetal-Movement Circuit
Kotaro Naruse, Takayuki Ueda, Jun Shiomi, Yoshihiro Midoh, Noriyuki Miura (Osaka Univ.) HWS2023-12
Abstract (in Japanese) (See Japanese page) 
(in English) As a yet unexploited high-energy source for powering ICs, this paper focused on high-energy plasma in a semiconductor fabrication process. Plasma-based Reactive Ion Etching (RIE) is one mainstream etching method in semiconductor fabrication. The high-energy plasma is used to process silicon and metal layers, but the Ion charging current is strong enough to break a transistor gate oxide. By harvesting stable power from this high-energy etching plasma, a computing circuit operating during its fabrication process can be realized, namely Fetal-Movement Circuit (FMC). In this paper, FMC is utilized to fabricate oxide-breakdown PUF successfully.
Keyword (in Japanese) (See Japanese page) 
(in English) plasma / semiconductor fabrication / Reactive Ion Etching (RIE) / PUF / oxide-breakdown / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 6, HWS2023-12, pp. 49-50, April 2023.
Paper # HWS2023-12 
Date of Issue 2023-04-07 (HWS) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF HWS2023-12

Conference Information
Committee HWS  
Conference Date 2023-04-14 - 2023-04-15 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To HWS 
Conference Code 2023-04-HWS 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) PUF Based on Fetal-Movement Circuit 
Sub Title (in English)  
Keyword(1) plasma  
Keyword(2) semiconductor fabrication  
Keyword(3) Reactive Ion Etching (RIE)  
Keyword(4) PUF  
Keyword(5) oxide-breakdown  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Kotaro Naruse  
1st Author's Affiliation Osaka University (Osaka Univ.)
2nd Author's Name Takayuki Ueda  
2nd Author's Affiliation Osaka University (Osaka Univ.)
3rd Author's Name Jun Shiomi  
3rd Author's Affiliation Osaka University (Osaka Univ.)
4th Author's Name Yoshihiro Midoh  
4th Author's Affiliation Osaka University (Osaka Univ.)
5th Author's Name Noriyuki Miura  
5th Author's Affiliation Osaka University (Osaka Univ.)
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2023-04-15 10:45:00 
Presentation Time 25 minutes 
Registration for HWS 
Paper # HWS2023-12 
Volume (vol) vol.123 
Number (no) no.6 
Page pp.49-50 
#Pages
Date of Issue 2023-04-07 (HWS) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan