Mon, Mar 2 AM 10:00 - 16:00 |
|
10:00-10:05 |
Opening Address ( 5 min. ) |
(1) |
10:05-10:35 |
[Invited Talk]
Bio-MEMS towards Single-Molecular Characterization |
Momoko Kumemura, Hiroyuki Fujita (Univ. of Tokyo) |
(2) |
10:35-11:05 |
[Invited Talk]
Integration Technology of 3D FPGA with Performance Scalability and Function Flexibility |
Kenichi Takeda, Mayu Aoki (Hitachi) |
(3) |
11:05-11:35 |
[Invited Talk]
High-density and Athermal Silicon Optical Interposers for Inter-chip Interconnects |
Takahiro Nakamura, Yutaka Urino (PETRA), Yasuhiko Arakawa (Univ. of Tokyo) |
(4) |
11:35-12:05 |
[Invited Talk]
Formation of Epitaxial Metal/Gemanium Contacts and Control of Electric Conduction Property at the Interface |
Osamu Nakatsuka, Yunsheng Deng, Akihiro Suzuki, Mitsuo Sakashita, Noriyuki Taoka, Shigeaki Zaima (Nagoya Univ.) |
|
12:05-13:05 |
Lunch Break ( 60 min. ) |
(5) |
13:05-13:35 |
[Invited Talk]
Area dependence of thermal stability factor in perpendicular STT-MRAM analized by bi-directional data flipping model |
Koji Tsunoda, Masaki Aoki, Hideyuki Noshiro, Yoshihisa Iba, Chikako Yoshida, Yuuichi Yamazaki, Atsushi Takahashi, Akiyoshi Hatada, Masaaki Nakabayashi, Toshihiro Sugii (LEAP) |
(6) |
13:35-14:05 |
[Invited Talk]
CNT Via Integration with Highly Dense and Selective CNT Growth |
Atsunobu Isobayashi, Makoto Wada, Ban Ito, Tatsuro Saito, Daisuke Nishide, T. Ishikura, Masayuki Katagiri, Yuichi Yamazaki, Takashi Matsumoto, Masayuki Kitamura, Masahito Watanabe, Naoshi Sakuma, Akihiro Kajita, Tadashi Sakai (LEAP) |
|
14:05-14:25 |
Break ( 20 min. ) |
(7) |
14:25-14:55 |
[Invited Talk]
Intercalated multi-layer graphene interconnects with low resistivity |
Daiyu Kondo (AIST/Fujitsu Labs.), Haruhisa Nakano, Bo Zhou, Akiko I (AIST), Kenjiro Hayashi (AIST/Fujitsu Labs.), Makoto Takahashi (AIST), Shintaro Sato, Naoki Yokoyama (AIST/Fujitsu Labs.) |
(8) |
14:55-15:25 |
[Invited Talk]
Effect of microtexture in electroplated copper thin-film interconnections on their migration resistance |
Ken Suzuki, Takery Kato, Hideo Miura (Tohoku Univ) |
(9) |
15:25-15:55 |
[Invited Talk]
Sub-nanoscale Structure and Barrier Performance of CVD-Cu(Mn)/ALD-Co(W) Interconnect System Proved Using 3D Atom Probe |
Kohei Shima (The Univ. of Tokyo), Yuan Tu, Bin Han, Hisashi Takamizawa (Tohoku Univ.), Hideharu Shimizu (The Univ. of Tokyo), Yasuo Shimizu (Tohoku Univ.), Takeshi Momose (The Univ. of Tokyo), Koji Inoue, Yasuyoshi Nagai (Tohoku Univ.), Yukihiro Shimogaki (The Univ. of Tokyo) |
|
15:55-16:00 |
Closing Address ( 5 min. ) |