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| Chair |
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Shunichiro Ohmi (Tokyo Inst. of Tech.) |
| Vice Chair |
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Tatsuya Usami (Rapidus Corporation) |
| Secretary |
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Tomoyuki Suwa (Tohoku Univ.), Taiji Noda (Panasonic) |
| Assistant |
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Takuji Hosoi (Kwansei Gakuin Univ.), Takuya Futase (SanDisk) |
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| Conference Date |
Tue, Feb 7, 2023 10:00 - 17:00 |
| Topics |
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| Conference Place |
Tokyo Univ. Hongo Takeda hall |
| Address |
113-8654 |
| Transportation Guide |
https://www.u-tokyo.ac.jp/campusmap/cam01_04_16_j.html |
Contact
Person |
Rapidus Corporation Tatsuya Usami
090-1559-4760 |
| Sponsors |
This conference is co-sponsored by The Japan Society of Applied Physics.
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| Registration Fee |
This workshop will be held as the IEICE workshop in fully electronic publishing. Registration fee will be necessary except the speakers and participants other than the participants to workshop(s) in non-electronic publishing. See the registration fee page. We request the registration fee or presentation fee to participants who will attend the workshop(s) on SDM. |
Tue, Feb 7 AM
10:00 - 17:00 |
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10:00-10:05 |
Opening ( 5 min. ) |
| (1) |
10:05-10:45 |
[Invited Talk]
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects |
Koichi Motoyama (IBM) |
| (2) |
10:45-11:25 |
[Invited Talk]
Atomic Layer and Conformal Etching Technologies of 3D Structures in Advanced Logic and Memory Devices |
Hiroto Ohtake (Hitachi High-Tech Corp.) |
| (3) |
11:25-12:05 |
[Invited Talk]
Advanced process technologies for continuous logic scaling towards 2nm node and beyond |
Tomonari Yamamoto (TEL) |
| |
12:05-13:20 |
Lunch Break ( 75 min. ) |
| (4) |
13:20-14:00 |
[Invited Talk]
Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI |
Kazumasa Tanida, Shigeru Suzuki, Toshiki Seo, Yasunori Morinaga, Hayato Korogi, Michinari Tetani, Masakazu Hamada, Ryuji Eto, Takeshi Yamashita, Yasuhiro Kato, Naoaki Sato, Tadami Shimizu, Tetsuro Hanawa, Hiroko Kubo, Fumitaka Ito, Yoshihiro Noguchi, Masayuki Nakamura, Ryuji Mizukoshi, Masahiko Takeuchi, Masakatsu Suzuki, Naoto Niisoe, Isao Miyanaga, Atsushi Ikeda, Susumu Matsumoto (TPSCo) |
| (5) |
14:00-14:40 |
[Invited Talk]
Applications of the surface activated bonding on heterogeneous Integration at room temperature |
Tadatomo Suga (Meisei Univ.) |
| (6) |
14:40-15:20 |
[Invited Talk]
New Approach for Epoxy Mold Compound Slurry in Advanced Packaging Technology |
Shogo Arata, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura (Resonac), Trianggono Widodo, Nagatoshi Tsunoda, Xavier Brun (Intel) |
| |
15:20-15:35 |
Break ( 15 min. ) |
| (7) |
15:35-16:15 |
[Invited Talk]
Temperature Dependence of Information Processing Performance of Ionic Liquid Type Intelligent Connection Device |
Masakazu Kobayashi (NAGASE), Hisashi Shima, Yasuhisa Naitoh, Hiroyuki Akinaga (AIST), Dan Sato, Takuma Matsuo, Masaharu Yonezawa, Kentaro Kinoshita (TUS), Toshiyuki Itoh (Toyota Phys. & Chem. Res. Inst.), Toshiki Nokami (Tottori Univ), Yasumitsu Orii (NAGASE) |
| (8) |
16:15-16:55 |
[Invited Talk]
Next-generation wearable electronics: Skin electronics |
Sunghoon Lee, Tomoyuki Yokota, Takao Someya (Univ. of Tokyo) |
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16:55-17:00 |
Closing ( 5 min. ) |
| Announcement for Speakers |
| General Talk | Each speech will have 20 minutes for presentation and 5 minutes for discussion. |
| Contact Address and Latest Schedule Information |
| SDM |
Technical Committee on Silicon Device and Materials (SDM) [Latest Schedule]
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| Contact Address |
※各研究会幹事もしくは担当者の連絡先を記載してください。 |
Last modified: 2023-02-06 17:10:22
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