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=============================================== Technical Meeting on Electromagnetic Compatibility (IEE-EMC) =============================================== Technical Committee on Electromagnetic Compatibility (EMCJ) Chair: Atsuhiro Nishikata (Tokyo Inst. of Tech.) Vice Chair: Kimihiro Tajima (NTT-AT) Secretary: Takashi Hikage (Hokkaido Univ.), Masayoshi Takahashi (Hitachi) Assistant: Kiyoto Matsushima (Hitachi), Kenji Ogata (ADOX), Toru Matsushima (Kyushu Inst. of Tech.) =============================================== Technical Meeting on Semiconductor Power Converter (IEE-SPC) DATE: Fri, May 12, 2023 13:15 - 17:45 PLACE: TOPICS: EMC ----- Opening Address ( 5 min. ) ----- ---------------------------------------- Fri, May 12 PM EMC I (13:15 - 14:30) Chair: Tadatoshi Sekine (Shizuoka Univ.) ---------------------------------------- (1)/EMCJ 13:15 - 13:40 Evaluating Transmission Efficiency Impact on Screen Reconstruction Accuracy for High-Resolution Displays Taiki Kitazawa, Yuichi Hayashi (NAIST) (2)/EMCJ 13:40 - 14:05 Investigation of Common Mode Termination Matching for Reducing System Dependence in EMC testing of Automotive Communications Hideki Iwasaki, Yusuke Yano, Jianqing Wang (NIT) (3)/EMCJ 14:05 - 14:30 Experimental evaluation result of preliminary measurement for in situ test method in CISPR 37 Kimihiro Tajima (NTT-AT), Nobuyuki Mitsuzuka (TELEC), Masashi Takabe, Eichi Kobayashi, Toshiaki Ono (NTT-AT) ----- Break ( 10 min. ) ----- ---------------------------------------- Fri, May 12 PM EMC II (14:40 - 16:20) ---------------------------------------- (4) 14:40 - 15:05 Verification of Load Voltage Characteristics Allowing Large Changes in Position and Load of S-SP Type Wireless Power Transfer due to Crossed Arrangement of Rod-shaped Coils ○Abe Hideaki (5) 15:05 - 15:30 A Study on Current Balancing in Parallel-connected SiC MOSFETs using Modular-multilevel Digital Active Gate Driver Takayama Hajime(Kyoto University)・Fukunaga Shuhei(Osaka University)・Hikihara Takashi(Kyoto University) (6) 15:30 - 15:55 A Study on Equivalent Circuit Modeling of Passive Components Based on Metaheuristic Algorithm Fukunaga Shuhei・Funaki Tsuyoshi(Osaka University) (7) 15:55 - 16:20 Design method of current type ACC with Rogowski coil applied to the detection part ○Okura Atsutoshi・Watsnabe Hiroki・Itoh Jun-ichi(Nagaoka University of Technology) ----- Break ( 10 min. ) ----- ---------------------------------------- Fri, May 12 PM EMC III (16:30 - 17:45) Chair: Kengo Iokibe (Okayama Univ.) ---------------------------------------- (8)/EMCJ 16:30 - 16:55 Intensity of electromagnetic noise of a deteriorated power unit Fumihiko Ishiyama (NTT) (9)/EMCJ 16:55 - 17:20 Magnetization Characteristics Expression for Ferromagnetic Materials and its Model Parameter Dependency in Non-linear Spring and Static Friction Model Atsuhiro Nishikata (Tokyo Tech) (10)/EMCJ 17:20 - 17:45 Fault Location using Deep Learning for TDR Waveforms in Overhead Distribution Systems with Few Branches Tohlu Matsushima, Daiki Nagata, Yuki Fukumoto (Kyutech), Takashi Hisakado (Kyoto Univ), Uki Kanenari, Tsuyoshi Iinuma, Yusuke Nishihiro (Kansai Transmission and Distribution, Inc.), Shin Toguchi (DAIHEN Corporation) ----- Closing Address ( 5 min. ) ----- # Information for speakers General Talk will have 20 minutes for presentation and 5 minutes for discussion. # CONFERENCE SPONSORS: - This conference is technical co-sponsored by This conference is technical co-sponsored by IEEE EMC Society Sendai Chapter and IEEE EMC Society Japan Joint Chapter.. === Technical Meeting on Electromagnetic Compatibility (IEE-EMC) === === Technical Committee on Electromagnetic Compatibility (EMCJ) === # FUTURE SCHEDULE: Fri, Jun 9, 2023: Otaru Chamber of Commerce & Industry [Fri, Apr 14], Topics: EMC Fri, Jul 21, 2023: [Fri, May 12] # SECRETARY: Tohlu Matsushima (Kyushu Institute of Technology.) emcj    === Technical Meeting on Semiconductor Power Converter (IEE-SPC) === # FUTURE SCHEDULE: Thu, Jul 20, 2023 - Fri, Jul 21, 2023 (tentative): [Thu, May 18] Last modified: 2023-05-10 23:26:22 |
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