| IEICE Technical Committee Submission System Advance Program |
Online Proceedings [Sign in] Tech. Rep. Archives |
| Go Top | Go Back | Prev SDM Conf / Next SDM Conf | [HTML] / [HTML(simple)] / [TEXT] | [Japanese] / [English] |
|
=============================================== Technical Committee on Silicon Device and Materials (SDM) Chair: Hiroshige Hirano (TowerPartners Semiconductor) Vice Chair: Shunichiro Ohmi (Tokyo Inst. of Tech.) Secretary: Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.) Assistant: Taiji Noda (Panasonic), Tomoyuki Suwa (Tohoku Univ.) DATE: Thu, Jan 28, 2021 13:05 - 17:05 PLACE: TOPICS: ---------------------------------------- Thu, Jan 28 PM (13:00 - 17:05) ---------------------------------------- ----- Opening Address ( 5 min. ) ----- (1) 13:05 - 13:35 [Invited Talk] **** Reika Ichihara (Kioxia) (2) 13:35 - 14:05 [Invited Talk] Diamond Semiconductor Devices, state-of-the-art of material growth and device processing Hitoshi Umezawa (AIST) (3) 14:05 - 14:35 [Invited Talk] Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance Kazuki Monta (Kobe Univ.) ----- Break ( 30 min. ) ----- (4) 15:05 - 15:35 [Invited Talk] Vertical Gate-All-Around Tunnel FETs Using InGaAs Nanowire/Si with Core-Multishell Structure Katsuhiro Tomioka, Hironori Gamo, Junichi Motohisa, Takashi Fukui (Hokkaido Univ.) (5) 15:35 - 16:05 [Invited Talk] Evaluation of Defects in Si Substrates Introduced by Stochastic Lateral Straggling during Plasma Exposure and Its Impact on Ultra-low Leakage Devices Yoshihiro Sato, Takayoshi Yamada, Kazuko Nishimura, Masayuki Yamasaki, Masashi Murakami (Panasonic), Keiichiro Urabe, Koji Eriguchi (Kyoto Univ.) (6) 16:05 - 16:35 [Invited Talk] Subband Engineering by Combination of Channel Thickness Scaling and (111) Surface Orientation in InAs-On-Insulator nMOSFETs Kei Sumita, Kasidit Toprasertpong, Mitsuru Takenaka, Shinich Takagi (Univ.of Tokyo) (7) 16:35 - 17:05 # Information for speakers Invited Talk will have 25 minutes for presentation and 5 minutes for discussion. # CONFERENCE SPONSORS: - This conference is co-sponsored by The Japan Society of Applied Physics. === Technical Committee on Silicon Device and Materials (SDM) === # FUTURE SCHEDULE: Fri, Feb 5, 2021: Online Fri, Apr 23, 2021 - Sat, Apr 24, 2021: Okinawaken Seinen Kaikan [Fri, Feb 12], Topics: Thin film devices (Si, compound, organic, flexible), Biotechnology, Materials, Characterization, etc. # SECRETARY: SDM Secretary: MORI Takahiro(National Institute of AIST) Tel +81-29-849-1149   -    aist Last modified: 2021-01-04 11:50:24 |
Notification: Mail addresses are partially hidden against SPAM.
[Download Paper's Information (in Japanese)] <-- Press download button after click here.
[Cover and Index of IEICE Technical Report by Issue]
[Presentation and Participation FAQ] (in Japanese)
[Return to SDM Schedule Page] /
| Go Top | Go Back | Prev SDM Conf / Next SDM Conf | [HTML] / [HTML(simple)] / [TEXT] | [Japanese] / [English] |
[Return to Top Page]