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| Chair |
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Hiroshige Hirano (TowerPartners Semiconductor) |
| Vice Chair |
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Shunichiro Ohmi (Tokyo Inst. of Tech.) |
| Secretary |
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Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.) |
| Assistant |
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Taiji Noda (Panasonic), Tomoyuki Suwa (Tohoku Univ.) |
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| Conference Date |
Fri, Feb 5, 2021 13:00 - 17:25 |
| Topics |
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| Conference Place |
Online |
| Sponsors |
This conference is co-sponsored by The Japan Society of Applied Physics.
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Copyright
and
reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
| Registration Fee |
This workshop will be held as the IEICE workshop in fully electronic publishing. Registration fee will be necessary except the speakers and participants other than the participants to workshop(s) in non-electronic publishing. See the registration fee page. We request the registration fee or presentation fee to participants who will attend the workshop(s) on SDM. |
Fri, Feb 5 PM
13:00 - 17:25 |
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13:00-13:05 |
Opening ( 5 min. ) |
| (1) |
13:05-13:45 |
[Invited Talk]
Ru Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect  SDM2020-55 |
Hirokazu Aizawa, Kaoru Maekawa, Kai-Hung Yu, Gyana Pattanaik, Gert Leusink (TTCA) |
| (2) |
13:45-14:05 |
Characteristic properties of Co-Zr alloy as a single-layer barrier SDM2020-56 |
Yuki Yamada, Masataka Yahagi, Junichi Koike (Tohoku Univ.) |
| (3) |
14:05-14:25 |
Limitation of barrier property of ultra-thin TaN film SDM2020-57 |
Toshihiro Kuge, Masataka Yahagi, Junichi Koike (Tohoku Univ.) |
| (4) |
14:25-15:05 |
[Invited Talk]
Impacts of Misalignment on 1um Pitch Cu-Cu Hybrid Bonding SDM2020-58 |
Yoshihisa Kagawa, Takumi Kamibayashi, Masaki Haneda, Nobuotoshi Fujii, Syunsuke Furuse, Hideto Hashiguch, Tomoyuki Hirano, Hayato Iwamoto (SSS) |
| |
15:05-15:20 |
Break ( 15 min. ) |
| (5) |
15:20-16:00 |
[Invited Talk]
AI for material, material for AI SDM2020-59 |
Shintaro Yamamichi (IBM Japan) |
| (6) |
16:00-16:40 |
[Invited Talk]
R&D of 3D-IC Technology in the era of AI, IoT, Big data SDM2020-60 |
Katsuya Kikuchi (AIST) |
| (7) |
16:40-17:20 |
[Invited Talk]
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme SDM2020-61 |
Shinji Sugatani, Norio Chujo, Koji Sakui, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba (Titech) |
| |
17:20-17:25 |
Closing ( 5 min. ) |
| Announcement for Speakers |
| General Talk | Each speech will have 15 minutes for presentation and 5 minutes for discussion. |
| Invited Talk | Each speech will have 30 minutes for presentation and 10 minutes for discussion. |
| Contact Address and Latest Schedule Information |
| SDM |
Technical Committee on Silicon Device and Materials (SDM) [Latest Schedule]
|
| Contact Address |
SDM Secretary: MORI Takahiro(National Institute of AIST)
Tel +81-29-849-1149
E-Mail   -    aist |
Last modified: 2020-12-24 11:56:09
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