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Technical Committee on Silicon Device and Materials (SDM) [schedule] [select]
Chair Hiroshige Hirano (TowerPartners Semiconductor)
Vice Chair Shunichiro Ohmi (Tokyo Inst. of Tech.)
Secretary Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.)
Assistant Taiji Noda (Panasonic), Tomoyuki Suwa (Tohoku Univ.)

Conference Date Fri, Feb 5, 2021 13:00 - 17:25
Topics  
Conference Place Online 
Sponsors This conference is co-sponsored by The Japan Society of Applied Physics.
Registration Fee This workshop will be held as the IEICE workshop in fully electronic publishing. Registration fee will be necessary except the speakers and participants other than the participants to workshop(s) in non-electronic publishing. See the registration fee page. We request the registration fee or presentation fee to participants who will attend the workshop(s) on SDM.

Fri, Feb 5 PM 
13:00 - 17:25
  13:00-13:05 Opening ( 5 min. )
(1) 13:05-13:45 [Invited Talk]
Ru Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect
Hirokazu Aizawa, Kaoru Maekawa, Kai-Hung Yu, Gyana Pattanaik, Gert Leusink (TTCA)
(2) 13:45-14:05 Characteristic properties of Co-Zr alloy as a single-layer barrier Yuki Yamada, Masataka Yahagi, Junichi Koike (Tohoku Univ.)
(3) 14:05-14:25 Limitation of barrier property of ultra-thin TaN film Toshihiro Kuge, Masataka Yahagi, Junichi Koike (Tohoku Univ.)
(4) 14:25-15:05 [Invited Talk]
Impacts of Misalignment on 1um Pitch Cu-Cu Hybrid Bonding
Yoshihisa Kagawa, Takumi Kamibayashi, Masaki Haneda, Nobuotoshi Fujii, Syunsuke Furuse, Hideto Hashiguch, Tomoyuki Hirano, Hayato Iwamoto (SSS)
  15:05-15:20 Break ( 15 min. )
(5) 15:20-16:00 [Invited Talk]
AI for material, material for AI
Shintaro Yamamichi (IBM Japan)
(6) 16:00-16:40 [Invited Talk]
R&D of 3D-IC Technology in the era of AI, IoT, Big data
Katsuya Kikuchi (AIST)
(7) 16:40-17:20 [Invited Talk]
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme
Shinji Sugatani, Norio Chujo, Koji Sakui, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba (Titech)
  17:20-17:25 Closing ( 5 min. )

Announcement for Speakers
General TalkEach speech will have 15 minutes for presentation and 5 minutes for discussion.
Invited TalkEach speech will have 30 minutes for presentation and 10 minutes for discussion.

Contact Address and Latest Schedule Information
SDM Technical Committee on Silicon Device and Materials (SDM)   [Latest Schedule]
Contact Address SDM Secretary: MORI Takahiro(National Institute of AIST)
Tel +81-29-849-1149
E-Mail -aist 


Last modified: 2020-12-24 11:56:09


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