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Technical Committee on Electron Devices (ED)  (Searched in: 2010)

Search Results: Keywords 'from:2010-06-17 to:2010-06-17'

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Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 15 of 15  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
ED 2010-06-17
13:00
Ishikawa JAIST Growth of InSb films on the V-grooved Si(001) substrate with InSb bi-layer
Tatsuya Iwasugi, Sara Khamseh, Azusa Kadoda, Kimihiko Nakatani, Masayuki Mori, Koichi Maezawa (Univ. of Toyama) ED2010-33
We have reported that InSb films grown on a Si(111) substrate with InSb bi-layer rotate by 30° degree with respect to Si... [more] ED2010-33
pp.1-4
ED 2010-06-17
13:25
Ishikawa JAIST Fabrication and characterization of InAs ultra-thin films on flexible substrates
Hayato Takita, Norihiko Hashimoto, Masahiro Kudo, Masashi Akabori, Toshi-kazu Suzuki (JAIST) ED2010-34
(To be available after the conference date) [more] ED2010-34
pp.5-9
ED 2010-06-17
13:50
Ishikawa JAIST Electrochemical Formation of InP Porous Structures and Their Application to High-Sensitive Chemical Sensors
Taketomo Sato, Naoki Yoshizawa, Hiroyuki Okazaki, Tamotsu Hashizume (Hokkaido Univ.) ED2010-35
(To be available after the conference date) [more] ED2010-35
pp.11-15
ED 2010-06-17
14:25
Ishikawa JAIST Analysis of electron velocity reduction rate due to self-heating in AlGaN/GaN heterojunction field-effect transistors
Toshi-kazu Suzuki, Nariaki Tanaka (JAIST) ED2010-36
(To be available after the conference date) [more] ED2010-36
pp.17-20
ED 2010-06-17
14:50
Ishikawa JAIST Electrical Characterization of Recessed-gate AlgaN/GaN Heterojunction FETs
Misato Mukohno, Naoki Yamada, Hirokuni Tokuda, Masaaki Kuzuhara (Univ. of Fukui.) ED2010-37
Recessed-gate AlGaN/GaN HFETs have been fabricated by using BCl3-based ICP dry-etching. It was confirmed that the thresh... [more] ED2010-37
pp.21-24
ED 2010-06-17
15:15
Ishikawa JAIST Fabrication of high-frequency and high-power AlGaN/GaN HEMTs
Yoshimi Yamashita, Issei Watanabe, Akira Endoh, Nobumitsu Hirose, Toshiaki Matsui (NICT), Takashi Mimura (NICT/Fujitsu lab.) ED2010-38
High-power AlGaN/GaN high electron mobility transistors (HEMTs) are the most promising devices for future high-speed and... [more] ED2010-38
pp.25-30
ED 2010-06-17
15:50
Ishikawa JAIST Effects of surface oxidation during device processing on surface barrier height of AlGaN/GaN HFETs
Masataka Higashiwaki (NICT/JST/UCSB), Srabanti Chowdhury, Brian L. Swenson, Umesh K. Mishra (UCSB) ED2010-39
We investigated effects of surface oxidation by annealing during device process on AlGaN surface barrier height of AlGaN... [more] ED2010-39
pp.31-35
ED 2010-06-17
16:15
Ishikawa JAIST Understanding of C-V characteristics in AlGaN/GaN MIS structure
Chihoko Mizue (Hokkaido Univ., RCIQE), Tamotsu Hashizume (Hokkaido Univ., RCIQE, JST-CREST) ED2010-40
 [more] ED2010-40
pp.37-40
ED 2010-06-17
16:40
Ishikawa JAIST Effect of interface properties on characteristics of carbon nanotube FETs
Yutaka Ohno, Naoki Moriyama, Takamitsu Kitamura, Kosuke Suzuki, Shigeru Kishimoto, Takashi Mizutani (Nagoya Univ.) ED2010-41
 [more] ED2010-41
pp.41-45
ED 2010-06-18
10:00
Ishikawa JAIST Theoretical Analysis of Carrier Transport in Nano-Scale InGaAs-Channel MOSFETs
Takahiro Homma, Hisanao Watanabe, Shinsuke Hara, Hiroki I. Fujishiro (Tokyo Univ. of Science.) ED2010-42
Because of higher carrier mobility owing to small effective mass, III-V compound semiconductors have been attracted much... [more] ED2010-42
pp.47-52
ED 2010-06-18
10:25
Ishikawa JAIST Theoretical analysis of operating conditions to suppress relaxation oscillations in Resonant Tunneling Diode biased at negative differential resistance region
Yosuke Itagaki, Kiyoto Asakawa, Hideaki Shin-ya, Mitsufumi Saito, Michihiko Suhara (Tokyo Metro.Univ) ED2010-43
A resonant tunneling diode (RTD) is an active device with negative differential resistance operating up to THz region in... [more] ED2010-43
pp.53-58
ED 2010-06-18
10:50
Ishikawa JAIST Promotion of power generation in Si solar cells made from low-purity Si wafers
Fumihiko Hirose, Yuki Sano, Satoru Tuzuki, Takahiko Suzuki (Yamagata Univ.) ED2010-44
 [more] ED2010-44
pp.59-61
ED 2010-06-18
11:25
Ishikawa JAIST Removal of Cu contaminants on silicon material surfaces by defect passivation etchless cleaning solutions
Masao Takahashi, Yuko Higashi, Hiroaki Narita, Hitoo Iwasa, Hikaru Kobayashi (Osaka Univ/JST) ED2010-45
Dilute HCN aqueous solutions with a concentration of 1ppm can remove Cu contaminants of 10^{12}~10^{13} atomc/cm^{2} con... [more] ED2010-45
pp.63-68
ED 2010-06-18
11:50
Ishikawa JAIST Photo corrosion of Metal Gate Electrodes during Wet
Daisuke Watanabe (Daikin Industries,Ltd.), Chiharu Kimura, Hidemitsu Aoki (Osaka Univ.) ED2010-46
Wet processes for removing high-k film involve the risk of enhanced galvanic corrosion at the gate electrode level. We f... [more] ED2010-46
pp.69-74
ED 2010-06-18
12:15
Ishikawa JAIST Methyl-BCN Film using Low Temperature Etching.
Hidemitsu Aoki, Makoto Hara, Takuro Masuzumi, Zhiming Lu, Tomohiro Kuki, Chiharu Kimura, Takashi Sugino (Osaka Univ.) ED2010-47
 [more] ED2010-47
pp.75-80
 Results 1 - 15 of 15  /   
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