IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

Technical Committee on Reliability (R)  (Searched in: 2014)

Search Results: Keywords 'from:2014-11-20 to:2014-11-20'

[Go to Official R Homepage (Japanese)] 
Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 6 of 6  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
R 2014-11-20
13:45
Osaka   Prediction of performance degradation and lifetime for semiconductor devices using markov chain model
Kai Momoda, Koichi Endo, Yoshihiro Midoh, Katsuyoshi Miura, Koji Nakamae (Osaka Univ.) R2014-61
We study on a method to predict performance degradation and lifetime of semiconductor devices under the assumption that ... [more] R2014-61
pp.1-5
R 2014-11-20
14:10
Osaka   Reliability Analysis for Degradation Process Data Based on Bayesian Methods
Toru Kaise (Univ. of Hyogo)
 [more]
R 2014-11-20
14:35
Osaka   Reliability Analysis for Degradation Processes Based on Stochastic Differential Equations
Toru Kaise (Univ. of Hyogo)
 [more]
R 2014-11-20
15:10
Osaka   The study about acceleration model of ceramic capacitors by voltage stress
Toshinari Matsuoka (MELCO) R2014-62
The maximum likelihood estimation is applied for acceleration modeling. The effectiveness of this method becomes clear i... [more] R2014-62
pp.7-14
R 2014-11-20
15:35
Osaka   Problem of Repeatability about Dew Test and Evaluation Method by Micro Dew Condensation Test
Mayuko Nishihara, Kazuhiro Hayashinuma (Murata.Co) R2014-63
Dew Cyclic test is one of most famous evaluation methods for Electro Chemical Migration (ECM). But this test is a proble... [more] R2014-63
pp.15-19
R 2014-11-20
16:00
Osaka   A Study on Evaluation for fretting corrosion
Sadanori Itou (itoken office) R2014-64
In the evaluation stand point of view for parts error phenomena proof stress, the contact friction increasing
phenomen... [more]
R2014-64
pp.21-24
 Results 1 - 6 of 6  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan