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Technical Committee on Silicon Device and Materials (SDM) [schedule] [select]
Chair Takahiro Shinada (Tohoku Univ.)
Vice Chair Hiroshige Hirano (TowerJazz Panasonic)
Secretary Hiroya Ikeda (Shizuoka Univ.), Tetsu Morooka (KIOXIA)
Assistant Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.)

Conference Date Fri, Feb 7, 2020 09:15 - 17:05
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Conference Place  
Sponsors This conference is co-sponsored by The Japan Society of Applied Physics.
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Registration Fee This workshop will be held as the IEICE workshop in fully electronic publishing. Registration fee will be necessary except the speakers and participants other than the participants to workshop(s) in non-electronic publishing. See the registration fee page. We request the registration fee or presentation fee to participants who will attend the workshop(s) on SDM.

Fri, Feb 7 AM 
09:15 - 17:05
  09:15-09:20 Opening ( 5 min. )
(1) 09:20-09:35 Formation of passivation layer on Cu and Co surfaces in BTA-H2O2 aqueous solutions SDM2019-88 Kondoh, Eiichi, Toyama, Mao, Takeuchi, Shota, Jin, Lianhua (Univ. Yamanashi), Ryota Koshino, Hamada, Satomi, Shima, Shohei, Hiyama, Hirokuni (Ebara Corp.)
(2) 09:35-10:10 [Invited Talk]
Impact of Homogeneously Dispersed Al Nanoclusters by Si-monolayer Insertion into Hf0.5Zr0.5O2 Film on FeFET Memory Array with Tight Threshold Voltage Distribution SDM2019-89
Tadashi Yamaguchi, Keiichi Maekawa, Takahiro Ohara, Atsushi Amo, Eiji Tsukuda, Kenichiro Sonoda, Hiroshi Yanagita, Masao Inoue, Masazumi Matsuura, Tomohiro Yamashita (Renesas)
(3) 10:10-10:45 [Invited Talk]
Stability of Cu Interconnect Surface after post CMP Cleaning SDM2019-90
Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC)
(4) 10:45-11:20 [Invited Talk]
Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packaging SDM2019-91
Murugesan Mariappan, Takafumi Fukushima (Tohoku Univ.)
(5) 11:20-11:55 [Invited Talk]
Novel Volatile Film for Precise Dual Damascene Fabrication SDM2019-92
Makoto Fujikawa, Tatsuya Yamaguchi (TTS), Yuki Kikuchi, Kaoru Maekawa (TTCA), Hiroaki Kawasaki, Yoji Iizuka (TEL)
  11:55-13:30 Lunch Break ( 95 min. )
(6) 13:30-14:20 [Special Invited Talk]
Possibility of intermetallic compounds for ultra-small scale interconnections SDM2019-93
Junichi Koike, Linghan Chen (Tohoku Univ), Shinji Yokogawa (Univ. Elec-Comm)
(7) 14:20-14:55 [Invited Talk]
Solution-processed interconnections using vacuum ultraviolet SDM2019-94
Takeo Minari, Wanli Li, Qingqing Sun, Lingying Li (NIMS), Xuying Liu (Zhengzhou Univ.), Masayuki Kanehara (C-INK)
(8) 14:55-15:30 [Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION SDM2019-95
Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI)
  15:30-15:50 Break ( 20 min. )
(9) 15:50-16:25 [Invited Talk]
Thermal Boundary Resistance of Metal/Dielectric Interfaces in Silicon Nanowire Thermoelectric Generators SDM2019-96
Tianzhuo Zhan (Waseda Univ.)
(10) 16:25-17:00 [Invited Talk]
Nanophotonics contributions to state-of-the-art CMOS Image Sensors SDM2019-97
Sozo Yokogawa (SSS)
  17:00-17:05 Closing ( 5 min. )

Announcement for Speakers
General TalkEach speech will have 15 minutes for presentation.
Invited TalkEach speech will have 30 minutes for presentation and 5 minutes for discussion.
Special Invited TalkEach speech will have 45 minutes for presentation and 5 minutes for discussion.

Contact Address and Latest Schedule Information
SDM Technical Committee on Silicon Device and Materials (SDM)   [Latest Schedule]
Contact Address Tetsu Morooka(KIOXIA Corp.)
Tel 059-390-7451 Fax 059-361-2739
E--mail: oxia 


Last modified: 2020-01-14 19:44:24


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