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ICD, CPM 2005-09-08
Tokyo Kikai-Shinko-Kaikan Bldg. Development of Design Techniques for Semiconductor-Package By using Simplified DRAM Macro Model of Power System
Satoshi Nakamura, Takashi Suga (Hitachi PERL), Mitsuaki Katagiri, Yoji Nishio, Seiji Funaba, Yukitoshi Hirose, イサ サトシ (Elpida)
In late years, MCP(Multi Chip Package) and SiP(System in Package) which has plural semiconductor chips in one package be... [more] CPM2005-87 ICD2005-97
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