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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SCE |
2016-08-08 10:30 |
Saitama |
Saitama Univ. (Omiya sonic city) |
Fabrication and Evaluation of Superconducting Tunnel Junctions with Embedded Coil for Applying Magnetic Field Koki Sakai, Kenji Yamaguchi (Saitama Univ.), Hiroshi Nakagawa, Masahiro Aoyagi (AIST), Masato Naruse, Hiroaki Myoren, Tohru Taino (Saitama Univ.) SCE2016-12 |
[more] |
SCE2016-12 pp.5-8 |
ICD, SDM |
2012-08-02 11:00 |
Hokkaido |
Sapporo Center for Gender Equality, Sapporo, Hokkaido |
Power Consumption Evaluation of COOL Chip : Heterogeneous Multi-Core Processors for energy-saving Embedded Systems Michiya Hagimoto, Hiroyuki Uchida, Takashi Omori, Yasumori Hibi, Yukoh Matsumoto (TOPS Systems), Fumito Imura, Naoya Watanabe, Katsuya Kikuchi, Motohiro Suzuki, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) |
[more] |
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ICD, SDM |
2012-08-02 14:15 |
Hokkaido |
Sapporo Center for Gender Equality, Sapporo, Hokkaido |
3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems Fumito Imura, Shunsuke Nemoto, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa (AIST), Michiya Hagimoto, Hiroyuki Uchida, Takashi Omori, Yasumori Hibi, Yukoh Matsumoto (TOPS Systems), Masahiro Aoyagi (AIST) SDM2012-71 ICD2012-39 |
We have proposed the ultrawide-interchip-bus system for the interchip communication of the 3-dimentional stacked LSI sys... [more] |
SDM2012-71 ICD2012-39 pp.43-48 |
VLD |
2012-03-06 11:00 |
Oita |
B-con Plaza |
LSI Implementation of Heterogeneous Multi-Chip Processor for energy-saving Embedded Systems : COOL Chip Hiroyuki Uchida, Michiya Hagimoto, Tomoyuki Morimoto, Nobuyuki Hikichi, Yukoh Matsumoto (TOPS Systems), Fumito Imura, Naoya Watanabe, Katsuya Kikuchi, Motohiro Suzuki, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) VLD2011-122 |
The authors have suggested the low-power embedded heterogeneous multi-chip processor system: COOL Chip. We designed two ... [more] |
VLD2011-122 pp.13-17 |
VLD |
2011-03-04 15:05 |
Okinawa |
Okinawaken-Danjo-Kyodo-Sankaku Center |
A scalable prototyping system for 3D-stacked LSI development Marco Chacin, Hiroyuki Uchida, Michiya Hagimoto, Takashi Miyazaki, Takeshi Ohkawa, Rimon Ikeno, Yukoh Matsumoto (TOPS Systems), Fumito Imura, Katsuya Kikuchi, Motohiro Suzuki, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) VLD2010-145 |
(To be available after the conference date) [more] |
VLD2010-145 pp.171-175 |
LQE |
2009-12-11 16:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Self-alignment technology of optical devices and optical sub-assembly for optical interconnect Atsushi Suzuki (NGK Spark Plug Co., Ltd.), Katsuya Kikuchi, Yoshikuni Okada, Hiroshi Nakagawa, Masahiro Aoyagi, Takashi Mikawa (AIST) LQE2009-153 |
We report a novel optical implementation technology and an optical subassembly for inter- and intra-cabinet optical sign... [more] |
LQE2009-153 pp.75-80 |
CPM, ICD |
2008-01-18 15:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A method of Ultra-fine Pad Interconnection using Electroless Deposition Tokihiko Yokoshima, Yasuhiro Yamaji, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) CPM2007-147 ICD2007-158 |
Decrease in bonding temperature and bonding pressure are key challenges for higher interconnection-density packages in r... [more] |
CPM2007-147 ICD2007-158 pp.111-116 |
CPM, LQE, OPE, EMD |
2007-08-23 15:35 |
Hokkaido |
Hokaido Univ. |
Fundamental Analysis of Coupling Efficiency and DMD for High-speed Board and Chip Level Optical Interconnects Yoshitsugu Wakazono, Atsushi Suzuki, Daisuke Nagao, Takaaki Ishikawa, Tomoyuki Hino, Yoichi Hashimoto, Hiroshi Masuda, Shuji Suzuki, Mitsuaki Tamura, Teiichi Suzuki, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi, Takashi Mikawa (AIST) EMD2007-38 CPM2007-59 OPE2007-76 LQE2007-39 |
We evaluated coupling efficiency between VCSEL and optical components and DMD(Differential Mode Delay) as a fundamental ... [more] |
EMD2007-38 CPM2007-59 OPE2007-76 LQE2007-39 pp.49-54 |
CPM, LQE, OPE, EMD |
2007-08-24 11:45 |
Hokkaido |
Hokaido Univ. |
The Fabrication of Multi Wavelength CWDM Monolithic VCSELs for High Density Packaging Tei-ichi Suzuki, Daisuke Nagao, Yoshitsugu Wakazono, Atsushi Suzuki, Takaaki Ishikawa, Hiroshi Masuda, Yoichi Hashimoto, Katsuya Kikuchi, Mitsuaki Tamura, Hiroshi Nakagawa, Masahiro Aoyagi, Takashi Mikawa (AIST) EMD2007-48 CPM2007-69 OPE2007-86 LQE2007-49 |
Two kinds of VCSELs with different wavelengths were monolithically fabricated on GaAs substrates for CWDM applications a... [more] |
EMD2007-48 CPM2007-69 OPE2007-86 LQE2007-49 pp.101-106 |
ICD, CPM |
2005-09-08 09:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Characteristic dielectric constant for polyimide thin films at 10GHz Shigemasa Segawa (PI R&D), Sachiko Ito, Katsuya Kikuchi, Kazuhiko Tokoro, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) |
[more] |
CPM2005-86 ICD2005-96 pp.7-12 |
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