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Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM, ICD 2008-01-18
13:50		 Tokyo Kikai-Shinko-Kaikan Bldg A Package-on-Package using Coreless Substrate with Excellent Power Integrity
Kentaro Mori, Jun Sakai, Katsumi Kikuchi, Shinji Watanabe, Tomoo Murakami, Shintaro Yamamichi (NEC) CPM2007-143 ICD2007-154		 (To be available after the conference date) [more] CPM2007-143 ICD2007-154
pp.87-92
ICD, CPM 2005-09-08
09:00		 Tokyo Kikai-Shinko-Kaikan Bldg. The comparison of electrical characteristics of FCBGA packaging substrate based on MLTS and conventional build-up PWB
Jun Sakai, Koichiro Nakase (NEC), Hirokazu Honda (NECエレクトロニクス), Hirobumi Inoue (NEC) 		We heve developed an ultra-thin high-density packaging substrate, called an MLTS (multi-layer thin substrate), that cons... [more] CPM2005-85 ICD2005-95
pp.1-6
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