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Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM, ICD 2008-01-18
16:10
Tokyo Kikai-Shinko-Kaikan Bldg Reliability evaluation of lead free solder joint against vibration load under thermal circumstance
Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.) CPM2007-148 ICD2007-159
The reliability of electronics solder joints is evaluated for each individual stress even if the electronics devices are... [more] CPM2007-148 ICD2007-159
pp.117-122
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