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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 7 of 7  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD, R 2017-02-17
16:00		 Shiga Omuron Kusatsu Factory Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices
Osmau Ohtani, Tomohiro Fukuhara (Omron Corp.) R2016-68 EMD2016-95		 The adhesives for the mechanical device such as Relay or Switch are required the tracking resistance, the contact reliab... [more] R2016-68 EMD2016-95
pp.49-52
EMD, R 2012-02-17
10:35		 Kyoto   The improvement of the sealing reliability of relays which use polycarbonate for the case
Yosuke Tatsuno, Osamu Otani, Tomohiro Fukuhara (OMRON) R2011-42 EMD2011-116		  [more] R2011-42 EMD2011-116
pp.1-6
R 2010-11-19
14:50		 Osaka   The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives
Tomohiro Fukuhara, Mitsuo Ito, Osamu Otani (OMRON) R2010-34		 Relays are used for various purposes, and are demanded for high operating reliability in a variety of environments. Seal... [more] R2010-34
pp.9-13
EMD, R 2010-02-19
13:00		 Osaka   A Study on Improvement for Seal property of Electromechanical Devices -- The behavior of One-Part Epoxy Resin in a narrow gap --
Osamu Otani, Seiji Nakajima, Tomohiro Fukuhara (OMRON Corp.) R2009-51 EMD2009-118		 Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and ... [more] R2009-51 EMD2009-118
pp.7-11
EMD 2009-10-30
17:05		 Tokyo   The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay
Tomohiro Fukuhara (OMRON Corp.) EMD2009-67		 In recent years, electronics components has a trend of increasing Surface Mount type because of needs for densely array ... [more] EMD2009-67
pp.51-56
R 2009-10-16
13:45		 Fukuoka Kyutech Plaza@Tenjin of Kyushu Institute of Technology The Sealing Reliability of Electronics Mechanical Devices
Tomohiro Fukuhara (OMRON Corp.) R2009-34		 Relays are one of electronics mechanical devices, and they are used for various purposes. So relays are demand for high ... [more] R2009-34
pp.7-12
OPE, EMD, CPM, LQE 2009-08-21
16:15		 Miyagi   Adhesive Technology of Electronics Devices
Tomohiro Fukuhara (OMRON Corp.) EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63		 Relays are used for various purposes, and are demand for high reliability. Especially, Sealing relays are packaged with ... [more] EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63
pp.157-162
 Results 1 - 7 of 7  /   
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